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Patent applications and USPTO patent grants for Ido; Ryuta.The latest application filed is for "clad material for electric contacts and method for producing the clad material".
Patent | Date |
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Clad material for electric contacts and method for producing the clad material Grant 11,094,478 - Niitsuma , et al. August 17, 2 | 2021-08-17 |
Seal ring, electronic component housing package, electronic device, and manufacturing methods thereof Grant 10,615,090 - Takeoka , et al. | 2020-04-07 |
Clad Material For Electric Contacts And Method For Producing The Clad Material App 20190139721 - NIITSUMA; Takumi ;   et al. | 2019-05-09 |
Package For Electronic Component Storage, Elecronic Device, And Manufacturing Method Thereof App 20180374767 - TAKEOKA; Harumi ;   et al. | 2018-12-27 |
Method And Device For Producing Silver-containing Layer, Silver-containing Layer, And Sliding Contact Material Using Silver-containing Layer App 20150292076 - Asada; Takao ;   et al. | 2015-10-15 |
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