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name:-0.0092771053314209
name:-0.0068290233612061
name:-0.0025241374969482
Ideguchi; Satoru Patent Filings

Ideguchi; Satoru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ideguchi; Satoru.The latest application filed is for "mask for partial plating, and method for producing insulated circuit board and partial plating method using the mask".

Company Profile
2.6.7
  • Ideguchi; Satoru - Tokyo JP
  • Ideguchi; Satoru - Nagano JP
  • Ideguchi; Satoru - Shiojiri JP
  • Ideguchi; Satoru - Shiojiri-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Mask For Partial Plating, And Method For Producing Insulated Circuit Board And Partial Plating Method Using The Mask
App 20220136126 - Higo; Masaaki ;   et al.
2022-05-05
Heat radiating plate and method for producing same
Grant 11,162,745 - Ideguchi , et al. November 2, 2
2021-11-02
Heat radiating plate with supporting members and protrusion members
Grant 10,619,948 - Ideguchi , et al.
2020-04-14
Heat Radiating Plate And Method For Producing Same
App 20200064087 - Ideguchi; Satoru ;   et al.
2020-02-27
Metal/ceramic bonding substrate and method for producing same
Grant 9,713,253 - Osanai , et al. July 18, 2
2017-07-18
Heat Radiating Plate And Method For Producing Same
App 20140083671 - Ideguchi; Satoru ;   et al.
2014-03-27
Metal/ceramic Bonding Substrate And Method For Producing Same
App 20140057131 - Osanai; Hideyo ;   et al.
2014-02-27
Aluminum/ceramic bonding substrate and method for producing same
Grant 7,393,596 - Osanai , et al. July 1, 2
2008-07-01
Aluminum/ceramic bonding substrate and method for producing same
Grant 7,255,931 - Osanai , et al. August 14, 2
2007-08-14
Aluminum/ceramic bonding substrate and method for producing same
App 20070042215 - Osanai; Hideyo ;   et al.
2007-02-22
Aluminum/ceramic bonding substrate and method for producing same
App 20050072547 - Osanai, Hideyo ;   et al.
2005-04-07

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