Ide; Mitsunori

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ide; Mitsunori.The latest application filed is for "curable resin composition and adhesive for bonding structural material using composition".

Company Profile

1.7.5

Ide; Mitsunori - Saitama JP
Ide; Mitsunori - Tokyo N/A JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Curable resin composition and adhesive for bonding structural material using composition Grant 11,208,579 - Ide , et al. December 28, 2	2021-12-28
Curable Resin Composition And Adhesive For Bonding Structural Material Using Composition App 20190249047 - IDE; Mitsunori ; et al.	2019-08-15
One liquid type cyanate-epoxy composite resin composition Grant 8,911,586 - Ogawa , et al. December 16, 2	2014-12-16
Hardenable epoxy resin composition Grant 8,426,504 - Mori , et al. April 23, 2	2013-04-23
One Liquid Type Cyanate-epoxy Composite Resin Composition App 20110095453 - Ogawa; Ryo ; et al.	2011-04-28
One liquid type cyanate-epoxy composite resin composition, its hardened material, manufacturing method thereof, and materials for sealing and adhesive agents using the same Grant 7,923,516 - Ogawa , et al. April 12, 2	2011-04-12
Epoxy resin curable composition for prepreg Grant 7,906,213 - Takahata , et al. March 15, 2	2011-03-15
One Liquid Type Cyanate-epoxy Composite Resin Composition, Its Hardened Material, Manufacturing Method Thereof, And Materials For Sealing And Adhesive Agents Using The Same App 20100210793 - Ogawa; Ryo ; et al.	2010-08-19
Hardenable Epoxy Resin Composition App 20100190899 - Mori; Takahiro ; et al.	2010-07-29
Epoxy Resin Curable Composition For Prepreg App 20090030147 - Takahata; Yoshinori ; et al.	2009-01-29

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