IDE; Eiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for IDE; Eiichi.The latest application filed is for "semiconductor device, electric power conversion device, and manufacturing method of semiconductor device".

Company Profile

3.42.38

IDE; Eiichi - Tokyo JP
Ide; Eiichi - Hitachi JP
Ide; Eiichi - Itami JP
Ide, Eiichi - Itami-Shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device, Electric Power Conversion Device, And Manufacturing Method Of Semiconductor Device App 20220166337 - IDE; Eiichi ; et al.	2022-05-26
Power semiconductor module with heat dissipation plate Grant 10,818,573 - Tsuyuno , et al. October 27, 2	2020-10-27
Power converter having water passages for cooling power modules Grant 10,701,842 - Ide , et al.	2020-06-30
Power conversion device Grant 10,194,563 - Tsuyuno , et al. Ja	2019-01-29
Heat-dissipating structure and semiconductor module using same Grant 10,177,069 - Naito , et al. J	2019-01-08
Semiconductor module and method of manufacturing semiconductor module Grant 10,177,084 - Tsuyuno , et al. J	2019-01-08
Power module and method for manufacturing the same Grant 10,080,313 - Shintani , et al. September 18, 2	2018-09-18
Structure App 20180254235 - TSUYUNO; Nobutake ; et al.	2018-09-06
Power-module device, power conversion device, and method for manufacturing power-module device Grant 10,064,310 - Tanie , et al. August 28, 2	2018-08-28
Power Converter App 20180146577 - IDE; Eiichi ; et al.	2018-05-24
Power conversion apparatus including wedge inserts Grant 9,870,974 - Ide , et al. January 16, 2	2018-01-16
Waterproof electronic device and manufacturing method thereof Grant 9,852,962 - Temmei , et al. December 26, 2	2017-12-26
Semiconductor Module And Method Of Manufacturing Semiconductor Module App 20170338176 - TSUYUNO; Nobutake ; et al.	2017-11-23
Power-Module Device, Power Conversion Device, and Method for Manufacturing Power-Module Device App 20170325360 - TANIE; Hisashi ; et al.	2017-11-09
Heat-dissipating Structure And Semiconductor Module Using Same App 20170236768 - NAITO; Takashi ; et al.	2017-08-17
Power Conversion Device App 20170223875 - TSUYUNO; NOBUTAKE ; et al.	2017-08-03
Power-Module Device and Power Conversion Device App 20170084515 - SHINTANI; Hiroshi ; et al.	2017-03-23
Power Conversion Apparatus App 20170069562 - IDE; Eiichi ; et al.	2017-03-09
Power semiconductor module and power module Grant 9,591,789 - Ide , et al. March 7, 2	2017-03-07
Semiconductor device and production method for same Grant 9,530,722 - Yamashita , et al. December 27, 2	2016-12-27
Waterproof Electronic Device and Manufacturing Method Thereof App 20160343636 - TEMMEI; Hiroyuki ; et al.	2016-11-24
Power Module And Method For Manufacturing The Same App 20160322281 - SHINTANI; Hiroshi ; et al.	2016-11-03
Power module Grant 9,439,332 - Ide , et al. September 6, 2	2016-09-06
Semiconductor Device and Production Method for Same App 20150294927 - Yamashita; Shiro ; et al.	2015-10-15
Power module and lead frame for power module Grant 9,076,780 - Negishi , et al. July 7, 2	2015-07-07
Semiconductor module and method for manufacturing semiconductor module Grant 8,952,525 - Ide , et al. February 10, 2	2015-02-10
Power Semiconductor Module and Power Module App 20150003019 - Ide; Eiichi ; et al.	2015-01-01
Semiconductor device and method for manufacturing same Grant 8,912,644 - Ide , et al. December 16, 2	2014-12-16
Power semiconductor module and manufacturing method thereof Grant 8,847,374 - Ide , et al. September 30, 2	2014-09-30
Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same Grant 8,840,811 - Yasuda , et al. September 23, 2	2014-09-23
Bonding method and bonding material using metal particle Grant 8,821,768 - Yasuda , et al. September 2, 2	2014-09-02
Low temperature bonding material comprising coated metal nanoparticles, and bonding method Grant 8,821,676 - Yasuda , et al. September 2, 2	2014-09-02
Semiconductor Module and Method for Manufacturing Semiconductor Module App 20140197532 - Ide; Eiichi ; et al.	2014-07-17
Power Module App 20140168901 - Ide; Eiichi ; et al.	2014-06-19
Semiconductor device and method of manufacturing the same Grant 8,592,996 - Morita , et al. November 26, 2	2013-11-26
Semiconductor Device And Method For Manufacturing Same App 20130299962 - IDE; Eiichi ; et al.	2013-11-14
Power Module And Lead Frame For Power Module App 20130270684 - Negishi; Yoshinori ; et al.	2013-10-17
Semiconductor device and bonding material Grant 8,513,534 - Morita , et al. August 20, 2	2013-08-20
Power Semiconductor Module and Manufacturing Method Thereof App 20130175678 - Ide; Eiichi ; et al.	2013-07-11
Conductive Sintered Layer Forming Composition App 20130119322 - Ide; Eiichi ; et al.	2013-05-16
Electronic member, electronic part and manufacturing method therefor Grant 8,400,777 - Ide , et al. March 19, 2	2013-03-19
Low Temperature Bonding Material And Bonding Method App 20120104618 - Yasuda; Yusuke ; et al.	2012-05-03
Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof Grant 8,008,772 - Morita , et al. August 30, 2	2011-08-30
Low Temperature Bonding Material And Bonding Method App 20110204125 - YASUDA; Yusuke ; et al.	2011-08-25
Low temperature bonding material comprising metal particles and bonding method Grant 7,955,411 - Yasuda , et al. June 7, 2	2011-06-07
Semiconductor Device And Method Of Manufacturing The Same App 20110012262 - MORITA; Toshiaki ; et al.	2011-01-20
Electrically Conductive Bonding Material, Method Of Bonding With The Same, And Semiconductor Device Bonded With The Same App 20100270515 - YASUDA; Yuusuke ; et al.	2010-10-28
Electronic Member, Electronic Part And Manufacturing Method Therefor App 20100195292 - Ide; Eiichi ; et al.	2010-08-05
Semiconductor device and bonding material App 20090244868 - Morita; Toshiaki ; et al.	2009-10-01
Semiconductor Device, Manufacturing Method Thereof, Composite Metal Body And Manufacturing Method Thereof App 20080237851 - Morita; Toshiaki ; et al.	2008-10-02
Low Temperature Bonding Material And Bonding Method App 20080173398 - Yasuda; Yusuke ; et al.	2008-07-24
Conductive Sintered Layer Forming Composition And Conductive Coating Film Forming Method And Bonding Method Using The Same App 20080160183 - Ide; Eiichi ; et al.	2008-07-03
Bonding Method And Bonding Material Using Metal Particle App 20080156398 - Yasuda; Yusuke ; et al.	2008-07-03
Three-dimensional shape measuring system Grant 7,027,641 - Ide , et al. April 11, 2	2006-04-11
Imaging system, two-dimensional photographing device and three-dimensional measuring device Grant 6,975,361 - Kamon , et al. December 13, 2	2005-12-13
Three-dimensional data input apparatus Grant 6,882,435 - Yagi , et al. April 19, 2	2005-04-19
Digital camera Grant 6,812,969 - Ide , et al. November 2, 2	2004-11-02
Digital camera App 20030174230 - Ide, Eiichi ; et al.	2003-09-18
Three-dimensional data input apparatus App 20030133129 - Yagi, Fumiya ; et al.	2003-07-17
Method and apparatus for inputting three-dimensional data Grant 6,556,307 - Norita , et al. April 29, 2	2003-04-29
Three-dimensional data input apparatus Grant 6,507,406 - Yagi , et al. January 14, 2	2003-01-14
Imaging system, two-dimensional photographing device and three-dimensional measuring device App 20010031143 - Kamon, Koichi ; et al.	2001-10-18
Three-dimensional shape measuring system App 20010012016 - Ide, Eiichi ; et al.	2001-08-09
Three-dimensional input device Grant 6,268,918 - Tanabe , et al. July 31, 2	2001-07-31
Three-dimensional measurement apparatus Grant 6,233,049 - Kondo , et al. May 15, 2	2001-05-15