Ida; Kensaku

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ida; Kensaku.The latest application filed is for "low k dielectric cvd film formation process with in-situ imbedded nanolayers to improve mechanical properties".

Company Profile

0.5.6

Ida; Kensaku - Wappingers Falls NY

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Patent Activity

Patent	Date
Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties Grant 7,998,880 - Nguyen , et al. August 16, 2	2011-08-16
LOW k DIELECTRIC CVD FILM FORMATION PROCESS WITH IN-SITU IMBEDDED NANOLAYERS TO IMPROVE MECHANICAL PROPERTIES App 20100028695 - Nguyen; Son V. ; et al.	2010-02-04
Advanced low dielectric constant organosilicon plasma chemical vapor deposition films Grant 7,494,938 - Nguyen , et al. February 24, 2	2009-02-24
Composite inter-level dielectric structure for an integrated circuit Grant 7,422,975 - Nogami , et al. September 9, 2	2008-09-09
Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties Grant 7,265,437 - Nguyen , et al. September 4, 2	2007-09-04
Advanced Low Dielectric Constant Organosilicon Plasma Chemical Vapor Deposition Films App 20070128882 - Nguyen; Son V. ; et al.	2007-06-07
Advanced low dielectric constant organosilicon plasma chemical vapor deposition films Grant 7,202,564 - Nguyen , et al. April 10, 2	2007-04-10
Composite inter-level dielectric structure for an integrated circuit App 20070042589 - Nogami; Takeshi ; et al.	2007-02-22
LOW k DIELECTRIC CVD FILM FORMATION PROCESS WITH IN-SITU IMBEDDED NANOLAYERS TO IMPROVE MECHANICAL PROPERTIES App 20060202311 - Nguyen; Son V. ; et al.	2006-09-14
Advanced Low Dielectric Constant Organosilicon Plasma Chemical Vapor Deposition Films App 20060183345 - Nguyen; Son ; et al.	2006-08-17
Dual damascene interconnection having low k layer and cap layer formed in a common PECVD process App 20060166491 - Ida; Kensaku	2006-07-27

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