Ichitani; Masahiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ichitani; Masahiro.The latest application filed is for "semiconductor device".
Company Profile
0.32.20
- Ichitani; Masahiro - Kodaira JP
- Ichitani, Masahiro - Tokyo JP
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor device Grant 7,615,872 - Takahashi , et al. November 10, 2 | 2009-11-10 |
| Semiconductor device App 20090091031 - Takahashi; Noriyuki ; et al. | 2009-04-09 |
| Semiconductor device Grant 7,479,705 - Takahashi , et al. January 20, 2 | 2009-01-20 |
| Semiconductor device Grant 7,286,386 - Miwa , et al. October 23, 2 | 2007-10-23 |
| Semiconductor device App 20060180943 - Miwa; Takashi ; et al. | 2006-08-17 |
| Stacked large-scale integrated circuit (LSI) semiconductor device with miniaturization and thinning of package Grant 7,061,785 - Miwa , et al. June 13, 2 | 2006-06-13 |
| Method of manufacturing a semiconductor device and a semiconductor device Grant 7,015,069 - Takahashi , et al. March 21, 2 | 2006-03-21 |
| Semiconductor device Grant 6,919,622 - Murakami , et al. July 19, 2 | 2005-07-19 |
| Method of manufacturing a semiconductor device and a semiconductor device App 20050127535 - Takahashi, Noriyuki ; et al. | 2005-06-16 |
| Method of manufacturing semiconductor package including forming a resin sealing member Grant 6,887,739 - Fujisawa , et al. May 3, 2 | 2005-05-03 |
| Method of manufacturing a semiconductor device and a semiconductor device Grant 6,872,597 - Takahashi , et al. March 29, 2 | 2005-03-29 |
| Semiconductor device App 20050046023 - Takahashi, Noriyuki ; et al. | 2005-03-03 |
| Method of manufacturing a semiconductor device and a semiconductor device App 20040164428 - Takahashi, Noriyuki ; et al. | 2004-08-26 |
| Semiconductor device App 20040155323 - Murakami, Gen ; et al. | 2004-08-12 |
| Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate Grant 6,764,878 - Fujisawa , et al. July 20, 2 | 2004-07-20 |
| Method of manufacturing semiconductor device having resin sealing body Grant 6,759,279 - Fujisawa , et al. July 6, 2 | 2004-07-06 |
| Method of manufacturing a semiconductor device using a mold Grant 6,723,583 - Takahashi , et al. April 20, 2 | 2004-04-20 |
| Semiconductor device Grant 6,720,208 - Murakami , et al. April 13, 2 | 2004-04-13 |
| Semiconductor device App 20040027869 - Miwa, Takashi ; et al. | 2004-02-12 |
| Method of manufacturing semiconductor device App 20040005733 - Fujisawa, Atsushi ; et al. | 2004-01-08 |
| Method of manufacturing a semiconductor device and a semiconductor device App 20030205797 - Takahashi, Noriyuki ; et al. | 2003-11-06 |
| Semiconductor device and mounting board Grant 6,621,160 - Shibamoto , et al. September 16, 2 | 2003-09-16 |
| Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufacture Grant 6,596,561 - Takahashi , et al. July 22, 2 | 2003-07-22 |
| Semiconductor device App 20030127712 - Murakami, Gen ; et al. | 2003-07-10 |
| Method of manufacturing semiconductor device App 20020192872 - Fujisawa, Atsushi ; et al. | 2002-12-19 |
| Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate App 20020182776 - Fujisawa, Atsushi ; et al. | 2002-12-05 |
| Ball grid array type semiconductor package having a flexible substrate Grant 6,476,466 - Fujisawa , et al. November 5, 2 | 2002-11-05 |
| Method of manufacturing a semiconductor device Grant 6,448,111 - Fujisawa , et al. September 10, 2 | 2002-09-10 |
| Semiconductor device, manufacturing method thereof and mounting board App 20020105070 - Shibamoto, Masanori ; et al. | 2002-08-08 |
| Ball grid array type semiconductor package having a flexible substrate App 20020079579 - Fujisawa, Atsushi ; et al. | 2002-06-27 |
| Method of manufacturing a semiconductor device and a semiconductor device App 20020074650 - Takahashi, Noriyuki ; et al. | 2002-06-20 |
| Ball grid array type semiconductor package having a flexible substrate App 20020070462 - Fujisawa, Atsushi ; et al. | 2002-06-13 |
| Semiconductor device, manufacturing method thereof and mounting board Grant 6,404,049 - Shibamoto , et al. June 11, 2 | 2002-06-11 |
| Semiconductor device, manufacturing method thereof and mounting board App 20020066955 - Shibamoto, Masanori ; et al. | 2002-06-06 |
| Semiconductor device App 20020056561 - Yaguchi, Akihiro ; et al. | 2002-05-16 |
| Semiconductor device Grant 6,340,793 - Yaguchi , et al. January 22, 2 | 2002-01-22 |
| Semiconductor device and its manufacturing method App 20010015489 - Fujisawa, Atsushi ; et al. | 2001-08-23 |
| Semiconductor device App 20010008302 - Murakami, Gen ; et al. | 2001-07-19 |
| Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting Grant 6,232,650 - Fujisawa , et al. May 15, 2 | 2001-05-15 |
| Semiconductor device having all outer leads extending from one side of a resin member Grant 6,100,580 - Murakami , et al. August 8, 2 | 2000-08-08 |
| Semiconductor device Grant 6,081,023 - Murakami , et al. June 27, 2 | 2000-06-27 |
| Semiconductor device chip on lead and lead on chip manufacturing Grant 6,069,029 - Murakami , et al. May 30, 2 | 2000-05-30 |
| Semiconductor device Grant 5,714,405 - Tsubosaki , et al. February 3, 1 | 1998-02-03 |
| Semiconductor device Grant 5,612,569 - Murakami , et al. March 18, 1 | 1997-03-18 |
| Semiconductor device with lead structure within the planar area of the device Grant 5,583,375 - Tsubosaki , et al. December 10, 1 | 1996-12-10 |
| Semiconductor device Grant 5,530,286 - Murakami , et al. June 25, 1 | 1996-06-25 |
| Packaged semiconductor device having stress absorbing film Grant 5,466,888 - Beng , et al. November 14, 1 | 1995-11-14 |
| Semiconductor leadframe and its production method and plastic encapsulated semiconductor device Grant 5,437,915 - Nishimura , et al. August 1, 1 | 1995-08-01 |
| Packaged semiconductor device having stress absorbing film Grant 5,406,028 - Beng , et al. April 11, 1 | 1995-04-11 |
| Semiconductor device Grant 5,358,904 - Murakami , et al. * October 25, 1 | 1994-10-25 |
| Semiconductor device having stacked lead structure Grant 5,252,854 - Arita , et al. October 12, 1 | 1993-10-12 |
| Semiconductor device Grant 5,068,712 - Murakami , et al. November 26, 1 | 1991-11-26 |
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