Ichise; Teruhisa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ichise; Teruhisa.The latest application filed is for "semiconductor integrated circuit device and process for manufacturing the same".

Company Profile

0.20.19

Ichise; Teruhisa - Ome JP
ICHISE; Teruhisa - Chuo-ku JP
Ichise; Teruhisa - Hachioji JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor integrated circuit device and process for manufacturing the same Grant 9,275,956 - Uchiyama , et al. March 1, 2	2016-03-01
Semiconductor Integrated Circuit Device And Process For Manufacturing The Same App 20150279788 - UCHIYAMA; Hiroyuki ; et al.	2015-10-01
Semiconductor integrated circuit device and process for manufacturing the same Grant 9,059,100 - Uchiyama , et al. June 16, 2	2015-06-16
Semiconductor Integrated Circuit Device And Process For Manufacturing The Same App 20140045320 - UCHIYAMA; Hiroyuki ; et al.	2014-02-13
Semiconductor integrated circuit device and process for manufacturing the same Grant 8,569,107 - Uchiyama , et al. October 29, 2	2013-10-29
Semiconductor integrated circuit device and process for manufacturing the same Grant 8,558,352 - Uchiyama , et al. October 15, 2	2013-10-15
Semiconductor Integrated Circuit Device And Process For Manufacturing The Same App 20120220104 - UCHIYAMA; Hiroyuki ; et al.	2012-08-30
Semiconductor integrated circuit device and process for manufacturing the same Grant 8,183,091 - Uchiyama , et al. May 22, 2	2012-05-22
Semiconductor Integrated Circuit Device And Process For Manufacturing The Same App 20120091565 - UCHIYAMA; Hiroyuki ; et al.	2012-04-19
Semiconductor Integrated Circuit Device And Process For Manufacturing The Same App 20100197105 - UCHIYAMA; Hiroyuki ; et al.	2010-08-05
Semiconductor integrated circuit device and process for manufacturing the same Grant 7,696,608 - Uchiyama , et al. April 13, 2	2010-04-13
Method for manufacturing semiconductor integrated circuit device Grant 7,687,849 - Kujirai , et al. March 30, 2	2010-03-30
Semiconductor Device And Method For Manufacturing The Same App 20090267160 - ICHISE; Teruhisa	2009-10-29
Semiconductor Integrated Circuit Device And Process For Manufacturing The Same App 20080283970 - Uchiyama; Hiroyuki ; et al.	2008-11-20
Method For Manufacturing Semiconductor Integrated Circuit Device App 20080237752 - Kujirai; Hiroshi ; et al.	2008-10-02
Method for manufacturing semiconductor integrated circuit device Grant 7,417,291 - Kujirai , et al. August 26, 2	2008-08-26
Semiconductor integrated circuit device and process for manufacturing the same Grant 7,327,014 - Uchiyama , et al. February 5, 2	2008-02-05
Method for manufacturing semiconductor integrated circuit device App 20070187783 - Kujirai; Hiroshi ; et al.	2007-08-16
Method for manufacturing semiconductor integrated circuit device Grant 7,224,034 - Kujirai , et al. May 29, 2	2007-05-29
Semiconductor integrated circuit device and process for manufacturing the same App 20070063315 - Uchiyama; Hiroyuki ; et al.	2007-03-22
Semiconductor integrated circuit device and process for manufacturing the same Grant 7,154,164 - Uchiyama , et al. December 26, 2	2006-12-26
Semiconductor integrated circuit device including dummy patterns located to reduce dishing Grant 7,112,870 - Uchiyama , et al. September 26, 2	2006-09-26
Semiconductor integrated circuit device and process for manufacturing the same App 20060192270 - Uchiyama; Hiroyuki ; et al.	2006-08-31
Semiconductor integrated circuit device including dummy patterns located to reduce dishing Grant 7,009,233 - Uchiyama , et al. March 7, 2	2006-03-07
Semiconductor integrated circuit device including dummy patterns located to reduce dishing App 20050110065 - Uchiyama, Hiroyuki ; et al.	2005-05-26
Method for manufacturing semiconductor integrated circuit device App 20050087880 - Kujirai, Hiroshi ; et al.	2005-04-28
Process for semiconductor apparatus including forming an insulator and a semiconductor film on the backside of the wafer and removing the semiconductor film from the backside Grant 6,861,359 - Ota , et al. March 1, 2	2005-03-01
Method for manufacturing semiconductor integrated circuit device Grant 6,828,242 - Kujirai , et al. December 7, 2	2004-12-07
Semiconductor integrated circuit device and the method of producing the same App 20040173838 - Ichise, Teruhisa ; et al.	2004-09-09
Semiconductor integrated circuit device and the method of producing the same Grant 6,740,924 - Ichise , et al. May 25, 2	2004-05-25
Semiconductor apparatus and process for its production App 20040026692 - Ota, Katsuhiro ; et al.	2004-02-12
Semiconductor integrated circuit device including dummy patterns located to reduce dishing App 20030183860 - Uchiyama, Hiroyuki ; et al.	2003-10-02
Semiconductor integrated circuit device including dummy patterns located to reduce dishing Grant 6,603,162 - Uchiyama , et al. August 5, 2	2003-08-05
Semiconductor integrated circuit device and the method of producing the same App 20030132476 - Ichise, Teruhisa ; et al.	2003-07-17
Method for manufacturing semiconductor integrated circuit device App 20030040183 - Kujirai, Hiroshi ; et al.	2003-02-27
Method of producing semiconductor integrated circuit device having a plug Grant 6,514,854 - Ichise , et al. February 4, 2	2003-02-04
Semiconductor integrated circuit device and the method of producing the same App 20020056916 - Ichise, Teruhisa ; et al.	2002-05-16

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