| Patent | Date |
|---|
Bidirectional Switch Module And Bidirectional Switch
App 20220310835 - ICHIRYU; Takashi ; et al. | 2022-09-29 |
Gate Drive Circuit, And Semiconductor Breaker
App 20220271738 - KINOSHITA; Yusuke ; et al. | 2022-08-25 |
Driver Circuit And Switch System
App 20220224321 - KINOSHITA; Yusuke ; et al. | 2022-07-14 |
Semiconductor device including heat-dissipating metal multilayer having different thermal conductivity, and method for manufacturing same
Grant 11,257,733 - Ichiryu , et al. February 22, 2 | 2022-02-22 |
Bidirectional Switch, Electrical Device, And Multi-level Inverter
App 20210408934 - KINOSHITA; Yusuke ; et al. | 2021-12-30 |
Bidirectional switch and bidirectional switch device including the switch
Grant 11,062,981 - Kinoshita , et al. July 13, 2 | 2021-07-13 |
Bidirectional Switch And Bidirectional Switch Device Including The Switch
App 20210104453 - KINOSHITA; Yusuke ; et al. | 2021-04-08 |
Semiconductor Device And Method For Fabricating The Same
App 20200027814 - ICHIRYU; Takashi ; et al. | 2020-01-23 |
Flexible touch sensor and method of manufacturing the same
Grant 10,228,806 - Tomita , et al. | 2019-03-12 |
Electronic component package including sealing resin layer, metal member, ceramic substrate, and electronic component and method for manufacturing the same
Grant 10,083,889 - Ichiryu , et al. September 25, 2 | 2018-09-25 |
Stretchable flexible substrate including first insulating layer, second insulating layer, first metal layer, and second metal layer
Grant 9,860,979 - Ichiryu , et al. January 2, 2 | 2018-01-02 |
Flexible substrate including stretchable sheet
Grant 9,844,133 - Tomita , et al. December 12, 2 | 2017-12-12 |
Electronic Component Package Including Sealing Resin Layer, Metal Member, Ceramic Substrate, And Electronic Component And Method For Manufacturing The Same
App 20170352603 - ICHIRYU; TAKASHI ; et al. | 2017-12-07 |
Electronic component package including electronic component, metal member, and sealing resin
Grant 9,812,385 - Kawakita , et al. November 7, 2 | 2017-11-07 |
Flexible Touch Sensor And Method Of Manufacturing The Same
App 20170300147 - TOMITA; Yoshihiro ; et al. | 2017-10-19 |
Flexible Substrate Including Stretchable Sheet
App 20170181277 - TOMITA; YOSHIHIRO ; et al. | 2017-06-22 |
Base Material With A Transparent Conductive Film, Method For Manufacturing The Same, Touch Panel, And Solar Cell
App 20170098490 - TSUJIMOTO; AKIRA ; et al. | 2017-04-06 |
Stretchable Flexible Substrate Including First Insulating Layer, Second Insulating Layer, First Metal Layer, And Second Metal Layer
App 20160353567 - ICHIRYU; TAKASHI ; et al. | 2016-12-01 |
Electronic Component Package Including Electronic Component, Metal Member, And Sealing Resin
App 20160351481 - KAWAKITA; KOJI ; et al. | 2016-12-01 |
Transparent electrode and method for manufacturing the same
Grant 9,330,811 - Ichiryu , et al. May 3, 2 | 2016-05-03 |
Base Material With A Transparent Conductive Film, Method For Manufacturing The Same, Touch Panel, And Solar Cell
App 20150255186 - TSUJIMOTO; AKIRA ; et al. | 2015-09-10 |
Electronic Component Package And Method For Manufacturing The Same
App 20150206819 - Ichiryu; Takashi ; et al. | 2015-07-23 |
Transparent Electrode And Method For Manufacturing The Same
App 20140151085 - Ichiryu; Takashi ; et al. | 2014-06-05 |
Flip-chip mounting method and bump formation method
Grant 8,691,683 - Hirano , et al. April 8, 2 | 2014-04-08 |
Method for making a semiconductor device on a flexible substrate
Grant 08617943 - | 2013-12-31 |
Method for making a semiconductor device on a flexible substrate
Grant 8,617,943 - Ichiryu , et al. December 31, 2 | 2013-12-31 |
Flexible semiconductor device and method for producing the same
Grant 8,525,178 - Ichiryu , et al. September 3, 2 | 2013-09-03 |
Flexible semiconductor device
Grant 8,525,172 - Hirano , et al. September 3, 2 | 2013-09-03 |
Flexible Semiconductor Device And Method For Manufacturing Same
App 20130168677 - HIRANO; Koichi ; et al. | 2013-07-04 |
Manufacturing method of flexible semiconductor device
Grant 8,367,488 - Ichiryu , et al. February 5, 2 | 2013-02-05 |
Flexible semiconductor device and method for manufacturing same
Grant 8,343,822 - Hirano , et al. January 1, 2 | 2013-01-01 |
Flip chip mounting method and bump forming method
Grant 8,283,246 - Kitae , et al. October 9, 2 | 2012-10-09 |
Flexible Semiconductor Device And Method For Producing The Same
App 20120181543 - Ichiryu; Takashi ; et al. | 2012-07-19 |
Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus
Grant 8,071,425 - Nakatani , et al. December 6, 2 | 2011-12-06 |
Module with a built-in component, and electronic device with the same
Grant 8,064,213 - Asahi , et al. November 22, 2 | 2011-11-22 |
Flip Chip Mounting Method And Bump Forming Method
App 20110201195 - KITAE; Takashi ; et al. | 2011-08-18 |
Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same
Grant 7,981,528 - Nakatani , et al. July 19, 2 | 2011-07-19 |
Manufacturing method of flexible semiconductor device and flexible semiconductor device
Grant 7,977,741 - Hirano , et al. July 12, 2 | 2011-07-12 |
Flip-chip Mounting Method And Bump Formation Method
App 20110162578 - Hirano; Koichi ; et al. | 2011-07-07 |
Metal Particles-dispersed Composition And Flip Chip Mounting Process And Bump-forming Process Using The Same
App 20110133137 - Hirano; Koichi ; et al. | 2011-06-09 |
Flip chip mounting method and bump forming method
Grant 7,951,700 - Kitae , et al. May 31, 2 | 2011-05-31 |
Manufacturing Method Of Flexible Semiconductor Device
App 20110121298 - Ichiryu; Takashi ; et al. | 2011-05-26 |
Flip-chip mounting method and bump formation method
Grant 7,927,997 - Hirano , et al. April 19, 2 | 2011-04-19 |
Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same
Grant 7,910,403 - Hirano , et al. March 22, 2 | 2011-03-22 |
Manufacturing Method Of Flexible Semiconductor Device And Flexible Semiconductor Device
App 20110049598 - HIRANO; Koichi ; et al. | 2011-03-03 |
Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body
Grant 7,875,496 - Nakatani , et al. January 25, 2 | 2011-01-25 |
Manufacturing method of flexible semiconductor device and flexible semiconductor device
Grant 7,851,281 - Hirano , et al. December 14, 2 | 2010-12-14 |
Flexible Semiconductor Device And Method For Manufacturing Same
App 20100283054 - Hirano; Koichi ; et al. | 2010-11-11 |
Method For Fabricating Flexible Semiconductor Device And Layered Film Used Therefore
App 20100276691 - Ichiryu; Takashi ; et al. | 2010-11-04 |
Flip Chip Mounting Body, Flip Chip Mounting Method And Flip Chip Mounting Apparatus
App 20100203675 - NAKATANI; Seiichi ; et al. | 2010-08-12 |
Flexible substrate, multilayer flexible substrate
Grant 7,773,386 - Yamashita , et al. August 10, 2 | 2010-08-10 |
Rfid Magnetic Sheet, Noncontact Ic Card And Portable Mobile Communication Apparatus
App 20100182144 - Yamashita; Yoshihisa ; et al. | 2010-07-22 |
Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method
Grant 7,754,529 - Tomita , et al. July 13, 2 | 2010-07-13 |
Method for producing connection member
Grant 7,748,110 - Asahi , et al. July 6, 2 | 2010-07-06 |
Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus
Grant 7,732,920 - Nakatani , et al. June 8, 2 | 2010-06-08 |
Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei
Grant 7,726,545 - Ichiryu , et al. June 1, 2 | 2010-06-01 |
Manufacturing Method Of Flexible Semiconductor Device And Flexible Semiconductor Device
App 20100012936 - Hirano; Koichi ; et al. | 2010-01-21 |
Flip Chip Mounting Body And Method For Mounting Such Flip Chip Mounting Body And Bump Forming Method
App 20090203169 - Tomita; Yoshihiro ; et al. | 2009-08-13 |
Flip Chip Mounting Method, Flip Chip Mounting Apparatus And Flip Chip Mounting Body
App 20090203170 - Nakatani; Seiichi ; et al. | 2009-08-13 |
Flexible substrate having interlaminar junctions, and process for producing the same
Grant 7,531,754 - Yamashita , et al. May 12, 2 | 2009-05-12 |
Flip-chip Mounting Body And Flip-chip Mounting Method
App 20090085227 - Shiraishi; Tsukasa ; et al. | 2009-04-02 |
Flip Chip Mounting Method And Bump Forming Method
App 20090023245 - Kitae; Takashi ; et al. | 2009-01-22 |
Flip Chip Mounting Body, Flip Chip Mounting Method And Flip Chip Mounting Apparatus
App 20090008800 - Nakatani; Seiichi ; et al. | 2009-01-08 |
Flexible substrate, multilayer flexible substrate and process for producing the same
App 20080210458 - Yamashita; Yoshihisa ; et al. | 2008-09-04 |
Flip Clip Mounting Process And Bump-Forming Process Using Electrically-Conductive Particles
App 20080165518 - Ichiryu; Takashi ; et al. | 2008-07-10 |
Metal Particles-Dispersed Composition and Flip Chip Mounting Process and Bump-Forming Process Using the Same
App 20080142966 - Hirano; Koichi ; et al. | 2008-06-19 |
Magnetic Sheet With Stripe-arranged Magnetic Grains, Rfid Magnetic Sheet, Magnetic Shielding Sheet And Method Of Manufacturing The Same
App 20080070003 - NAKATANI; Seiichi ; et al. | 2008-03-20 |
Connection member and mount assembly and production method of the same
App 20080047137 - Asahi; Toshiyuki ; et al. | 2008-02-28 |
Flexible substrate, multilayer flexible substrate and process for producing the same
Grant 7,321,496 - Yamashita , et al. January 22, 2 | 2008-01-22 |
Module With Built-In Semiconductor And Method For Manufacturing The Module
App 20070262470 - Ichiryu; Takashi ; et al. | 2007-11-15 |
Flip-Chip Mounting Method and Bump Formation Method
App 20070243664 - Hirano; Koichi ; et al. | 2007-10-18 |
Optical Transmission Channel Board, Board With Built-in Optical Transmission Channel, And Data Processing Apparatus
App 20070224735 - Karashima; Seiji ; et al. | 2007-09-27 |
Connection member and mount assembly and production method of the same
Grant 7,258,549 - Asahi , et al. August 21, 2 | 2007-08-21 |
Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatus
Grant 7,242,823 - Karashima , et al. July 10, 2 | 2007-07-10 |
Flexible substrate having interlaminar junctions, and process for producing the same
App 20070151756 - Yamashita; Yoshihisa ; et al. | 2007-07-05 |
Flexible substrate having interlaminar junctions, and process for producing the same
Grant 7,205,483 - Yamashita , et al. April 17, 2 | 2007-04-17 |
Flexible substrate, Multilayer flexible substrate and process for producing the same
App 20050205294 - Yamashita, Yoshihisa ; et al. | 2005-09-22 |
Flexible substrate having interlaminar junctions, and process for producing the same
App 20050205291 - Yamashita, Yoshihisa ; et al. | 2005-09-22 |
Fabrication method for optical transmission channel board, optical transmission channel board, board with built-in optical transmission channel, fabrication method for board with built-in optical transmission channel, and data processing apparatus
App 20050196095 - Karashima, Seiji ; et al. | 2005-09-08 |
Connection member and mount assembly and production method of the same
App 20050184381 - Asahi, Toshiyuki ; et al. | 2005-08-25 |
Module with a built-in component, and electronic device with the same
App 20050168960 - Asahi, Toshiyuki ; et al. | 2005-08-04 |
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