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Patent applications and USPTO patent grants for ICHINOSEKI; Chikara.The latest application filed is for "resin composition and molded body".
Patent | Date |
---|---|
Resin Composition And Molded Body App 20220169848 - SHIMIZU; Takahiro ;   et al. | 2022-06-02 |
Pressure-sensitive Adhesive Film Or Sheet, Surface Protection Film Or Sheet, And Using Method For Surface Protection Of Article App 20130330548 - Aoyama; Masataka ;   et al. | 2013-12-12 |
Laminate Film, And Film For Use In Production Of Semiconductor Comprising Same App 20130130001 - Aoyama; Masataka ;   et al. | 2013-05-23 |
Thermoplastic resin composition, process for manufacture and use thereof App 20110034633 - Nakano; Shigenori ;   et al. | 2011-02-10 |
Thermoplastic resin composition, process for manufacture and use thereof App 20080176062 - Nakano; Shigenori ;   et al. | 2008-07-24 |
Thermoplastic resin composition, process for manufacture and use thereof App 20060189758 - Nakano; Shigenori ;   et al. | 2006-08-24 |
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