Ichinose; Michihiko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ichinose; Michihiko.The latest application filed is for "bga type semiconductor device having a solder-flow damping/stopping pattern".
- Ichinose; Michihiko - Tokyo JP
| Patent | Date |
|---|---|
| Semiconductor device and packaging method thereof Grant 6,747,361 - Ichinose June 8, 2 | 2004-06-08 |
| Resin-encapsulated semiconductor device Grant 6,611,063 - Ichinose , et al. August 26, 2 | 2003-08-26 |
| Semiconductor device and semiconductor module using the same Grant 6,504,244 - Ichinose , et al. January 7, 2 | 2003-01-07 |
| BGA type semiconductor device having a solder-flow damping/stopping pattern App 20020014683 - Ichinose, Michihiko | 2002-02-07 |
| Semiconductor device and packaging method thereof App 20020011651 - Ichinose, Michihiko | 2002-01-31 |
| Semiconductor device and semiconductor module using the same App 20010010396 - Ichinose, Michihiko ; et al. | 2001-08-02 |
| Semiconductor device, and semiconductor device with die pad and protruding chip lead frame and method of manufacturing the same Grant 6,265,760 - Inaba , et al. July 24, 2 | 2001-07-24 |
| Semiconductor device with reduced thickness Grant 6,166,443 - Inaba , et al. December 26, 2 | 2000-12-26 |
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