Ichinose; Kouji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ichinose; Kouji.The latest application filed is for "suspension board assembly sheet with circuits and manufacturing method of the same".
- Ichinose; Kouji - Ibaraki JP
- Ichinose; Kouji - Osaka JP
- ICHINOSE; Kouji - Ibaraki-shi JP
| Patent | Date |
|---|---|
| Conductivity inspection method of printed circuit board and manufacturing method of printed circuit board Grant 10,264,684 - Ihara , et al. | 2019-04-16 |
| Suspension board assembly sheet with circuits and manufacturing method of the same Grant 9,648,726 - Ichinose , et al. May 9, 2 | 2017-05-09 |
| Suspension Board Assembly Sheet With Circuits And Manufacturing Method Of The Same App 20150181695 - ICHINOSE; Kouji ; et al. | 2015-06-25 |
| Conductivity Inspection Method Of Printed Circuit Board And Manufacturing Method Of Printed Circuit Board App 20150059162 - IHARA; Terukazu ; et al. | 2015-03-05 |
| Wired Circuit Board App 20140353007 - ICHINOSE; Kouji ; et al. | 2014-12-04 |
| Wired circuit board Grant 8,658,903 - Kamei , et al. February 25, 2 | 2014-02-25 |
| Wired circuit board App 20120111608 - Kamei; Katsutoshi ; et al. | 2012-05-10 |
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