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Patent applications and USPTO patent grants for Ichimura; Takahide.The latest application filed is for "wiring editing method, for semiconductor package, capable of easily editing offset of wiring pattern".
Patent | Date |
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Wiring editing method, for semiconductor package, capable of easily editing offset of wiring pattern Grant 6,662,351 - Kitamura , et al. December 9, 2 | 2003-12-09 |
Wiring editing method, for semiconductor package, capable of easily editing offset of wiring pattern App 20020035720 - Kitamura, Tamotsu ;   et al. | 2002-03-21 |
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