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Patent applications and USPTO patent grants for Ichimura; Syuji.The latest application filed is for "adhesive resin pellets and method of manufacturing same".
Patent | Date |
---|---|
Adhesive resin pellets and method of manufacturing same Grant 10,822,526 - Ichimura , et al. November 3, 2 | 2020-11-03 |
Adhesive Resin Pellets And Method Of Manufacturing Same App 20180104855 - ICHIMURA; Syuji ;   et al. | 2018-04-19 |
Chip-resistant film Grant 9,586,388 - Ichimura , et al. March 7, 2 | 2017-03-07 |
Chip-resistant Film App 20150090391 - ICHIMURA; Syuji ;   et al. | 2015-04-02 |
Anti-chipping sheet Grant 8,962,125 - Ichimura , et al. February 24, 2 | 2015-02-24 |
Surface Protective Sheet App 20110020643 - Endo; Mikihiro ;   et al. | 2011-01-27 |
Anti-chipping Sheet App 20110008599 - Ichimura; Syuji ;   et al. | 2011-01-13 |
Chip-Resistant Film App 20100167049 - Ichimura; Syuji ;   et al. | 2010-07-01 |
Surface Protective Sheet App 20080286571 - Ichimura; Syuji ;   et al. | 2008-11-20 |
Pressure-sensitive adhesive compositions for surface-protecting films Grant 6,902,786 - Kitazaki , et al. June 7, 2 | 2005-06-07 |
Surface-protective pressure-sensitive adhesive sheet Grant 6,872,447 - Endo , et al. March 29, 2 | 2005-03-29 |
Pressure-sensitive adhesive compositions for surface-protecting films App 20030004266 - Kitazaki, Yasuaki ;   et al. | 2003-01-02 |
Pressure-sensitive adhesive sheet for surface protection Grant 5,965,255 - Ichimura , et al. October 12, 1 | 1999-10-12 |
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