Ichimura; Shigeki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ichimura; Shigeki.The latest application filed is for "cushion material, seat cushion material, and seat".

Company Profile

2.5.8

Ichimura; Shigeki - Yokohama JP
Ichimura; Shigeki - Yokohama-shi JP
Ichimura; Shigeki - Kanagawa JP
Ichimura; Shigeki - Oyama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Cushion material, seat cushion material, and seat Grant 11,001,690 - Ichimura , et al. May 11, 2	2021-05-11
Cushion Material, Seat Cushion Material, And Seat App 20190010301 - Ichimura; Shigeki ; et al.	2019-01-10
Base Material For Solar Cell Module And Method For Producing Same App 20130167927 - Ichimura; Shigeki ; et al.	2013-07-04
Solar Cell Sealant Sheet And Sealant-integrated Substrate App 20120167985 - Ichimura; Shigeki ; et al.	2012-07-05
Solar Cell Back Surface Protection Sheet And Method Of Manufacturing The Same App 20120114951 - Ichimura; Shigeki ; et al.	2012-05-10
Gasket, Method For Producing The Gasket, And Gasket Installation Method App 20070298272 - Kusakawa; Kouichi ; et al.	2007-12-27
Resin composition for foam molding, foam and method for producing the foam App 20070082962 - Kusakawa; Koichi ; et al.	2007-04-12
Resin composition for foam molding, foam and method for producing the foam App 20070072952 - Kusakawa; Koichi ; et al.	2007-03-29
Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them Grant 6,331,729 - Yusa , et al. December 18, 2	2001-12-18
Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package Grant 6,236,108 - Sota , et al. May 22, 2	2001-05-22
Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package Grant 6,064,111 - Sota , et al. May 16, 2	2000-05-16
Epoxy resin molding material for sealing of electronic component Grant 5,319,005 - Hagiwara , et al. June 7, 1	1994-06-07

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