loadpatents
Patent applications and USPTO patent grants for Ichikawa; Sumihiro.The latest application filed is for "backing memeber and ultrasonic probe".
Patent | Date |
---|---|
Backing Memeber And Ultrasonic Probe App 20190231308 - Ichikawa; Sumihiro | 2019-08-01 |
Wiring substrate with buried substrate having linear conductors Grant 9,960,120 - Fukasawa , et al. May 1, 2 | 2018-05-01 |
Packaging structure of substrates connected by metal terminals Grant 9,922,960 - Ichikawa March 20, 2 | 2018-03-20 |
Packaging structure Grant 9,824,993 - Ichikawa November 21, 2 | 2017-11-21 |
Packaging Structure App 20170033071 - ICHIKAWA; Sumihiro | 2017-02-02 |
Packaging Structure App 20170025387 - ICHIKAWA; Sumihiro | 2017-01-26 |
Wiring Substrate And Semiconductor Package App 20160293535 - Fukasawa; Ryo ;   et al. | 2016-10-06 |
Semiconductor device and method for manufacturing semiconductor device Grant 9,048,225 - Ichikawa , et al. June 2, 2 | 2015-06-02 |
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20140239508 - Ichikawa; Sumihiro ;   et al. | 2014-08-28 |
Dye sensitized solar cell module and manufacturing method thereof Grant 7,977,569 - Ichikawa , et al. July 12, 2 | 2011-07-12 |
Method and apparatus for processing a conductive thin film Grant 7,648,906 - Takei , et al. January 19, 2 | 2010-01-19 |
Dye Sensitized Solar Cell Module And Manufacturing Method Thereof App 20080236662 - Ichikawa; Sumihiro ;   et al. | 2008-10-02 |
Method and apparatus for processing a conductive thin film App 20060160340 - Takei; Koji ;   et al. | 2006-07-20 |
Compound semiconductor solar cell and production method thereof Grant 6,307,148 - Takeuchi , et al. October 23, 2 | 2001-10-23 |
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