Ichikawa; Matsuo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ichikawa; Matsuo.The latest application filed is for "bonding pad structures for semiconductor integrated circuits".
- Ichikawa; Matsuo - Suwa JP
- Ichikawa; Matsuo - Takasaki JP
- Ichikawa; Matsuo - Gunma JP
| Patent | Date |
|---|---|
| Bonding pad structures for semiconductor integrated circuits Grant 5,719,448 - Ichikawa February 17, 1 | 1998-02-17 |
| Method for manufacturing improved lightly doped diffusion (LDD) semiconductor device Grant 5,399,514 - Ichikawa March 21, 1 | 1995-03-21 |
| Semiconductor integrated circuit device with nitride barrier layer ion implanted with resistivity decreasing elements Grant 5,138,425 - Ichikawa August 11, 1 | 1992-08-11 |
| MIS type semiconductor integrated circuit device having a refractory metal gate electrode and refractory metal silicide film covering the gate electrode Grant 5,003,375 - Ichikawa March 26, 1 | 1991-03-26 |
| Combined auxiliary light and cover therefor Grant D289,554 - Ichikawa April 28, 1 | 1987-04-28 |
| Method of preparing a semiconductor device Grant 4,560,582 - Ichikawa December 24, 1 | 1985-12-24 |
| Fog light Grant D270,190 - Ichikawa August 16, 1 | 1983-08-16 |
| Automotive headlight Grant 4,276,584 - Ichikawa June 30, 1 | 1981-06-30 |
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