Ichikawa; Masashi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ichikawa; Masashi.The latest application filed is for "information transmitting apparatus, multifunctional peripheral, information transmitting method, and non-transitory recording medium".

Company Profile

5.7.10

Ichikawa; Masashi - Sakai JP
ICHIKAWA; Masashi - Sakai City JP
Ichikawa; Masashi - Fukushima JP
Ichikawa; Masashi - Nishishirakawa-gun JP
Ichikawa; Masashi - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Information transmitting apparatus, multifunctional peripheral, information transmitting method, and non-transitory recording medium Grant 10,812,665 - Ichikawa , et al. October 20, 2	2020-10-20
Information Transmitting Apparatus, Multifunctional Peripheral, Information Transmitting Method, And Non-transitory Recording Medium App 20190068803 - ICHIKAWA; Masashi ; et al.	2019-02-28
Information Transmission Apparatus, Information Transmission System, Multifunction Peripheral, Information Transmission Method, And Information Transmission Program App 20190068804 - ICHIKAWA; MASASHI ; et al.	2019-02-28
Information Transmitting Apparatus, Information Transmitting System, Multifunctional Peripheral, Information Transmitting Method, And Non-transitory Recording Medium App 20190068834 - ICHIKAWA; Masashi ; et al.	2019-02-28
Information Transmission Apparatus, Information Transmission System, Multifunction Peripheral, Information Transmission Method, And Information Transmission Program App 20190068835 - ICHIKAWA; MASASHI ; et al.	2019-02-28
Surface Grinding Method and Manufacturing Method for Semiconductor Wafer App 20090203212 - Ichikawa; Masashi ; et al.	2009-08-13
Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semi Grant 7,474,386 - Fujisawa , et al. January 6, 2	2009-01-06
Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semi Grant 7,365,830 - Fujisawa , et al. April 29, 2	2008-04-29
Method for manufacturing SOI wafer Grant 7,276,427 - Ichikawa , et al. October 2, 2	2007-10-02
Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semi App 20070177126 - Fujisawa; Tadahito ; et al.	2007-08-02
Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semi App 20070177127 - Fujisawa; Tadahito ; et al.	2007-08-02
Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semi Grant 7,230,680 - Fujisawa , et al. June 12, 2	2007-06-12
Method for manufacturing semiconductor wafer, method for receiving order for manufacture of semiconductor wafer, and system for receiving order for manufacture of semiconductor wafer Grant 7,203,559 - Ito , et al. April 10, 2	2007-04-10
Method for manufacturing soi wafer App 20060014330 - Ichikawa; Masashi ; et al.	2006-01-19
Semiconductor wafer manufacturing method, semiconductor wafer mnaufacturing order acceptance method, and semiconductor wafer manufacturing order acceptance system App 20050085017 - Ito, Tatsuo ; et al.	2005-04-21
Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semi App 20040185662 - Fujisawa, Tadahito ; et al.	2004-09-23
Method for manufacturing an interconnection structure in a semiconductor device Grant 6,048,792 - Watanabe , et al. April 11, 2	2000-04-11

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