Ichikawa; Koichiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ichikawa; Koichiro.The latest application filed is for "wafer head template for chemical mechanical polishing and a method for its use".
- Ichikawa; Koichiro - Nagano JP
- Ichikawa; Koichiro - Nagano-shi JP
| Patent | Date |
|---|---|
| Polishing apparatus and method of polishing work Grant 8,333,882 - Sato , et al. December 18, 2 | 2012-12-18 |
| Wafer Head Template For Chemical Mechanical Polishing And A Method For Its Use App 20100112905 - Borucki; Leonard ; et al. | 2010-05-06 |
| Method And Apparatus For Determining Shear Force Between The Wafer Head And Polishing Pad In Chemical Mechanical Polishing App 20100099333 - Sudargho; Fransisca Maria Astrid ; et al. | 2010-04-22 |
| Polishing apparatus and method of polishing work App 20070108067 - Sato; Unkai ; et al. | 2007-05-17 |
| Apparatus for polishing peripheral portion of wafer Grant 5,928,066 - Hasegawa , et al. July 27, 1 | 1999-07-27 |
| Apparatus for polishing the periphery portion of a wafer Grant 5,476,413 - Hasegawa , et al. December 19, 1 | 1995-12-19 |
| Apparatus for polishing notch portion of wafer Grant 5,458,529 - Hasegawa , et al. October 17, 1 | 1995-10-17 |
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