Ichikawa; Kazuya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ichikawa; Kazuya.The latest application filed is for "solder alloy, solder paste, and electronic circuit board".

Company Profile

1.4.5

Ichikawa; Kazuya - Hyogo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Solder alloy, solder paste, and electronic circuit board Grant 10,518,362 - Ikeda , et al. Dec	2019-12-31
Solder Alloy, Solder Paste, And Electronic Circuit Board App 20180214989 - IKEDA; Kazuki ; et al.	2018-08-02
Solder alloy, solder paste, and electronic circuit board Grant 9,956,649 - Ikeda , et al. May 1, 2	2018-05-01
Solder alloy, solder composition, solder paste, and electronic circuit board Grant 9,931,716 - Ikeda , et al. April 3, 2	2018-04-03
Solder Alloy, Solder Paste And Electronic Circuit Board App 20170355043 - IKEDA; Kazuki ; et al.	2017-12-14
Solder Alloy, Solder Paste, And Electronic Circuit Board App 20160288271 - IKEDA; Kazuki ; et al.	2016-10-06
Solder Alloy, Solder Composition, Solder Paste, And Electronic Circuit Board App 20160271737 - IKEDA; Kazuki ; et al.	2016-09-22
Solder alloy, solder paste, and electronic circuit board Grant 9,445,508 - Nakanishi , et al. September 13, 2	2016-09-13
Solder Alloy, Solder Paste, And Electronic Circuit Board App 20150305167 - NAKANISHI; Kensuke ; et al.	2015-10-22

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