ICHIKAWA; Hirofumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for ICHIKAWA; Hirofumi.The latest application filed is for "light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body".

Company Profile

6.23.17

ICHIKAWA; Hirofumi - Komatsushima-shi JP
Ichikawa; Hirofumi - Komatsushima JP
Ichikawa; Hirofumi - Tokushima JP
ICHIKAWA; Hirofumi - Tokushima-shi JP
Ichikawa; Hirofumi - Kanagawa N/A JP
Ichikawa; Hirofumi - Anan JP
Ichikawa; Hirofumi - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light Emitting Device, Resin Package, Resin-molded Body, And Methods For Manufacturing Light Emitting Device, Resin Package And Resin-molded Body App 20210336094 - ICHIKAWA; Hirofumi ; et al.	2021-10-28
Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body Grant 11,094,854 - Ichikawa , et al. August 17, 2	2021-08-17
Light Emitting Device, Resin Package, Resin-molded Body, And Methods For Manufacturing Light Emitting Device, Resin Package And App 20200287096 - ICHIKAWA; Hirofumi ; et al.	2020-09-10
Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body Grant 10,700,241 - Ichikawa , et al.	2020-06-30
Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body Grant 10,573,789 - Ichikawa , et al. Feb	2020-02-25
Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body Grant 10,573,788 - Ichikawa , et al. Feb	2020-02-25
Light Emitting Device, Resin Package, Resin-molded Body, And Methods For Manufacturing Light Emitting Device, Resin Package And Resin-molded Body App 20190088825 - ICHIKAWA; Hirofumi ; et al.	2019-03-21
Light Emitting Device, Resin Package, Resin-molded Body, And Methods For Manufacturing Light Emitting Device, Resin Package And Resin-molded Body App 20190035981 - ICHIKAWA; Hirofumi ; et al.	2019-01-31
Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body Grant 10,115,870 - Ichikawa , et al. October 30, 2	2018-10-30
Light Emitting Device, Resin Package, Resin-molded Body, And Methods For Manufacturing Light Emitting Device, Resin Package And Resin-molded Body App 20180301600 - ICHIKAWA; Hirofumi ; et al.	2018-10-18
Light emitting device Grant 9,960,326 - Kuramoto , et al. May 1, 2	2018-05-01
Light emitting device having silicone resin-based sealing member Grant 9,893,250 - Ichikawa , et al. February 13, 2	2018-02-13
Light Emitting Device App 20170162765 - KURAMOTO; Masafumi ; et al.	2017-06-08
Light Emitting Device, Resin Package, Resin-molded Body, And Methods For Manufacturing Light Emitting Device, Resin Package And Resin-molded Body App 20170141273 - ICHIKAWA; Hirofumi ; et al.	2017-05-18
Light emitting device Grant 9,653,662 - Kuramoto , et al. May 16, 2	2017-05-16
Light emitting device and resin composition Grant 9,559,274 - Ota , et al. January 31, 2	2017-01-31
Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body Grant 9,537,071 - Ichikawa , et al. January 3, 2	2017-01-03
Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body Grant 9,490,411 - Ichikawa , et al. November 8, 2	2016-11-08
Light-emitting device Grant 9,472,735 - Ichikawa , et al. October 18, 2	2016-10-18
Light Emitting Device And Resin Composition App 20160233396 - OTA; Akihiro ; et al.	2016-08-11
Light-emitting Device App 20160233388 - ICHIKAWA; Hirofumi ; et al.	2016-08-11
Light emitting device and resin composition Grant 9,397,276 - Ota , et al. July 19, 2	2016-07-19
Light Emitting Device And Resin Composition App 20160111610 - OTA; Akihiro ; et al.	2016-04-21
Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body Grant 9,287,476 - Ichikawa , et al. March 15, 2	2016-03-15
Light Emitting Device, Resin Package, Resin-molded Body, And Methods For Manufacturing Light Emitting Device, Resin Package And Resin-molded Body App 20160056357 - ICHIKAWA; Hirofumi ; et al.	2016-02-25
Light Emitting Device, Resin Package, Resin-molded Body, And Methods For Manufacturing Light Emitting Device, Resin Package And Resin-molded Body App 20160049566 - ICHIKAWA; Hirofumi ; et al.	2016-02-18
Light Emitting Device App 20150162509 - KURAMOTO; Masafumi ; et al.	2015-06-11
Light Emitting Device, Resin Package, Resin-molded Body, And Methods For Manufacturing Light Emitting Device, Resin Package And Resin-molded Body App 20140084320 - ICHIKAWA; Hirofumi ; et al.	2014-03-27
Headphones Grant D691,105 - Ito , et al. October 8, 2	2013-10-08
Headphones Grant D690,681 - Ito , et al. October 1, 2	2013-10-01
Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body Grant 8,530,250 - Ichikawa , et al. September 10, 2	2013-09-10
Light emitting device and backlight unit using the same Grant 8,426,879 - Kitani , et al. April 23, 2	2013-04-23
Light Emitting Device, Resin Package, Resin-molded Body, And Methods For Manufacturing Light Emitting Device, Resin Package And Resin-molded Body App 20110210354 - Ichikawa; Hirofumi ; et al.	2011-09-01
Method for inhibiting the discoloration of methylenebisaniline compounds Grant 7,632,424 - Nagasawa , et al. December 15, 2	2009-12-15
Light Emitting Device and Backlight Unit Using the Same App 20090134411 - Kitani; Motohisa ; et al.	2009-05-28
Method for inhibiting the discoloration of methylenebisaniline compounds App 20070108416 - Nagasawa; Mato ; et al.	2007-05-17

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