Ichida; Akira

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ichida; Akira.The latest application filed is for "semiconductor package and method for producing heat-radiating substrate for it".

Company Profile

0.7.3

Ichida; Akira - Toyama JP
Ichida; Akira - Toyama-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package and method for producing heat-radiating substrate for it Grant 6,926,861 - Hirayama , et al. August 9, 2	2005-08-09
Semiconductor package and method for producing heat-radiating substrate for it App 20040056352 - Hirayama, Norio ; et al.	2004-03-25
Semiconductor package and method for producing heat-radiating substrate for it Grant 6,693,353 - Hirayama , et al. February 17, 2	2004-02-17
Plasma facing components of nuclear fusion reactors employing tungsten materials Grant 6,610,375 - Akiba , et al. August 26, 2	2003-08-26
Semiconductor package using micro balls and production method thereof Grant 6,518,667 - Ichida , et al. February 11, 2	2003-02-11
Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same App 20020017346 - Osada, Mitsuo ; et al.	2002-02-14
Plasma facing components of nuclear fusion reactors employing tungsten materials App 20020015466 - Akiba, Masato ; et al.	2002-02-07
Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same Grant 6,271,585 - Osada , et al. August 7, 2	2001-08-07
Plasma facing components of nuclear fusion reactors employing tungsten materials Grant 6,261,648 - Akiba , et al. July 17, 2	2001-07-17
Plastic-packaged semiconductor device having a heat sink matched with a plastic package Grant 5,493,153 - Arikawa , et al. February 20, 1	1996-02-20

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