Icemos Technology Corporation

Patent Applications and Registrations

Patent applications and USPTO patent grants for Icemos Technology Corporation.The latest application filed is for "semiconductor device with oxide-nitride stack".

Company Profile

0.5.31

Icemos Technology Corporation - Tempe AZ
ICEMOS TECHNOLOGY CORPORATION - P.O. Box 24619 Tempe AZ
ICEMOS TECHNOLOGY CORPORATION - P.O. BOX 24619 7855 South River Parkway Tempe AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device with Oxide-Nitride Stack App 20220293531 - Muthuseenu; Kiraneswar ; et al.	2022-09-15
Semiconductor device with oxide-nitride stack Grant 11,362,042 - Muthuseenu , et al. June 14, 2	2022-06-14
Semiconductor Device With Oxide-nitride Stack App 20210233864 - MUTHUSEENU; Kiraneswar ; et al.	2021-07-29
Multi-directional Trenching Of A Plurality Of Dies In Manufacturing Superjunction Devices App 20090085148 - Ishiguro; Takeshi ; et al.	2009-04-02
Multi-directional Trenching Of A Die In Manufacturing Superjunction Devices App 20090085147 - Ishiguro; Takeshi ; et al.	2009-04-02
Superjunction Device Having Oxide Lined Trenches and Method for Manufacturing a Superjunction Device Having Oxide Lined Trenches App 20090026586 - Anderson; Samuel	2009-01-29
Photodetector Array Using Isolation Diffusions As Crosstalk Inhibitors Between Adjacent Photodiodes App 20080315269 - Wilson; Robin ; et al.	2008-12-25
Silicon Wafer Having Through-Wafer Vias App 20080315368 - MacNamara; Cormac ; et al.	2008-12-25
Technique for Stable Processing of Thin/Fragile Substrates App 20080315345 - Wilson; Robin ; et al.	2008-12-25
Bonded-wafer Superjunction Semiconductor Device App 20080315247 - Brogan; Conor ; et al.	2008-12-25
Front Lip PIN/NIP Diode Having a Continuous Anode/Cathode App 20080299698 - Wilson; Robin ; et al.	2008-12-04
Superjunction Devices Having Narrow Surface Layout Of Terminal Structures And Methods Of Manufacturing The Devices App 20080272429 - Ishiguro; Takeshi	2008-11-06
Bonded-wafer superjunction semiconductor device Grant 7,446,018 - Brogan , et al. November 4, 2	2008-11-04
Methods For Manufacturing A Trench Type Semiconductor Device Having A Thermally Sensitive Refill Material App 20080258239 - Ishiguro; Takeshi	2008-10-23
Methods For Manufacturing A Trench Type Semiconductor Device Having A Thermally Sensitive Refill Material App 20080258226 - Ishiguro; Takeshi	2008-10-23
Technique for stable processing of thin/fragile substrates Grant 7,439,178 - Wilson , et al. October 21, 2	2008-10-21
Photodetector Array Using Isolation Diffusions As Crosstalk Inhibitors Between Adjacent Photodiodes App 20080248606 - Wilson; Robin ; et al.	2008-10-09
Positive-intrinsic-negative (pin)/negative-intrinsic-positive (nip) Diode App 20080246122 - Wilson; Robin ; et al.	2008-10-09
Front Side Electrical Contact For Photodetector Array And Method Of Making Same App 20080248608 - Wilson; Robin ; et al.	2008-10-09
Technique for stable processing of thin/fragile substrates Grant 7,429,772 - Wilson , et al. September 30, 2	2008-09-30
Varying Pitch Adapter and a Method of Forming a Varying Pitch Adapter App 20080122040 - Brogan; Conor ; et al.	2008-05-29
Method Of Manufacturing A Photodiode Array With Through-wafer Vias App 20080099870 - Wilson; Robin ; et al.	2008-05-01
Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric Shape App 20080099924 - MacNamara; Cormac ; et al.	2008-05-01
Semiconductor Devices With Sealed, Unlined Trenches And Methods Of Forming Same App 20080036015 - Anderson; Samuel ; et al.	2008-02-14
Technique for Stable Processing of Thin/Fragile Substrates App 20070262378 - Wilson; Robin ; et al.	2007-11-15
Technique for Stable Processing of Thin/Fragile Substrates App 20070254457 - Wilson; Robin ; et al.	2007-11-01
Front Side Electrical Contact For Photodetector Array And Method Of Making Same App 20070215968 - Wilson; Robin ; et al.	2007-09-20
Photodiode Having Increased Proportion Of Light-sensitive Area To Light-insensitive Area App 20070205478 - Wilson; Robin ; et al.	2007-09-06
Backlit Photodiode and Method of Manufacturing a Backlit Photodiode App 20070138588 - Wilson; Robin ; et al.	2007-06-21
Front Lit PIN/NIP Diode Having a Continuous Anode/Cathode App 20070111356 - Wilson; Robin ; et al.	2007-05-17
Photodetector array using isolation diffusions as crosstalk inhibitors between adjacent photodiodes App 20070085117 - Wilson; Robin ; et al.	2007-04-19
Positive-Intrinsic-Negative (PIN) / Negative-Intrinsic-Positive (NIP) Diode App 20070077725 - Wilson; Robin ; et al.	2007-04-05
Bonded-wafer Superjunction Semiconductor Device App 20070063217 - Brogan; Conor ; et al.	2007-03-22
Silicon Wafer Having Through-Wafer Vias App 20060275946 - MacNamara; Cormac ; et al.	2006-12-07

Company Registrations

SEC

0001468943

IceMOS Technology Corp of DELAWARE

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.