name:-0.018378019332886
name:-0.0045380592346191
name:-0.0064089298248291
Ibrahim; Tarek Patent Filings

Ibrahim; Tarek

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ibrahim; Tarek.The latest application filed is for "coreless electronic substrates having embedded inductors".

Company Profile
7.4.15
  • Ibrahim; Tarek - Mesa AZ
  • Ibrahim; Tarek - Hoboken NJ US
  • Ibrahim; Tarek - Curl AU
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Coreless Electronic Substrates Having Embedded Inductors
App 20220285079 - Pietambaram; Srinivas ;   et al.
2022-09-08
Selectively Roughened Copper Architectures For Low Insertion Loss Conductive Features
App 20220102259 - Kong; Jieying ;   et al.
2022-03-31
Conductive Route Patterning For Electronic Substrates
App 20220093520 - Ecton; Jeremy D. ;   et al.
2022-03-24
Electronic Substrates Having Embedded Inductors
App 20220093316 - Duong; Benjamin ;   et al.
2022-03-24
Inorganic-based Embedded-die Layers For Modular Semiconductive Devices
App 20220028788 - PIETAMBARAM; Srinivas V. ;   et al.
2022-01-27
Inorganic-based embedded-die layers for modular semiconductive devices
Grant 11,164,818 - Pietambaram , et al. November 2, 2
2021-11-02
In-plane Inductors In Ic Packages
App 20210273036 - Marin; Brandon C. ;   et al.
2021-09-02
Protruding Sn Substrate Features For Epoxy Flow Control
App 20210020531 - CETEGEN; Edvin ;   et al.
2021-01-21
Corner Guard For Improved Electroplated First Level Interconnect Bump Height Range
App 20210020532 - VEHONSKY; Jacob ;   et al.
2021-01-21
Sandwich-molded Cores For High-inductance Architectures
App 20210014972 - MARIN; Brandon C. ;   et al.
2021-01-14
Inductors For Package Substrates
App 20210005550 - CHAVALI; Sri Chaitra Jyotsna ;   et al.
2021-01-07
Lithographically Defined Vertical Interconnect Access (via) For A Bridge Die First Level Interconnect (fli)
App 20200411441 - DARMAWIKARTA; Kristof ;   et al.
2020-12-31
Inorganic-based Embedded-die Layers For Modular Semiconductive Devices
App 20200312767 - Pietambaram; Srinivas V. ;   et al.
2020-10-01
Pico cell wireless local area network (WLAN)
Grant 9,565,610 - Ibrahim , et al. February 7, 2
2017-02-07
Pico Cell Wireless Local Area Network (wlan)
App 20120300746 - Ibrahim; Tarek ;   et al.
2012-11-29
Pico Cell Wireless Local Area Network (Wlan)
App 20070232307 - Ibrahim; Tarek ;   et al.
2007-10-04
Insulated drink container
Grant D432,865 - Cohen October 31, 2
2000-10-31

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