Ibe; Seiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ibe; Seiichi.The latest application filed is for "food packaging method".

Company Profile

0.6.6

Ibe; Seiichi - Ibaraki JP
Ibe; Seiichi - Omitama JP
Ibe; Seiichi - Omitama-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermally shrinkable laminate film for deep drawing, packaged article, and method for packaging of cheese Grant 9,566,768 - Ibe , et al. February 14, 2	2017-02-14
Food packaging method Grant 9,204,666 - Ibe , et al. December 8, 2	2015-12-08
Food Packaging Method App 20140041337 - Ibe; Seiichi ; et al.	2014-02-13
Deep drawing packaging container, deep drawing packaged product and method of manufacturing the same Grant 8,247,047 - Ishii , et al. August 21, 2	2012-08-21
Heat shrinkable multilayer film and packaging material using the same Grant 7,993,713 - Ishii , et al. August 9, 2	2011-08-09
Deep drawing heat shrinkable multilayer film and method of manufacturing the same Grant 7,959,995 - Ishii , et al. June 14, 2	2011-06-14
Thermally Shrinkable Laminate Film For Deep Drawing, Packaged Article, And Method For Packaging Of Cheese App 20110129576 - Ibe; Seiichi ; et al.	2011-06-02
Tightly-fitting Food Package And Food Packaging Method App 20100104701 - Ibe; Seiichi ; et al.	2010-04-29
Deep drawing packaging container, deep drawing packaged product and method of manufacturing the same App 20100003433 - Ishii; Hitoshi ; et al.	2010-01-07
Heat Shrinkable Multilayer Film and Packaging Material Using the Same App 20090136726 - Ishii; Hitoshi ; et al.	2009-05-28
Deep drawing heat shrinkable multilayer film and method of manufacturing the same App 20070237915 - Ishii; Hitoshi ; et al.	2007-10-11

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