I; Ya-Tung

Patent Applications and Registrations

Patent applications and USPTO patent grants for I; Ya-Tung.The latest application filed is for "electronic module with an improved shell and method for making the same".

Company Profile

2.4.8

I; Ya-Tung - Taipei TW
I; Ya-Tung - New Taipei TW
I; YA-TUNG - NEW TAIPEI CITY TW
I; Ya-Tung - Taipei County TW
I; Ya-Tung - Jhonghe TW
I; Ya-Tung - Jhonghe City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic module with an improved shell and method for making the same Grant 10,477,710 - I , et al. Nov	2019-11-12
Housing having housing parts bondable together and method of manufacturing the same Grant 10,375,846 - I , et al.	2019-08-06
Electronic Module With An Improved Shell And Method For Making The Same App 20180343757 - I; YA-TUNG ; et al.	2018-11-29
Housing Having Housing Parts Bondable Together And Method Of Manufacturing The Same App 20180206349 - I; YA-TUNG ; et al.	2018-07-19
Planar heat dissipation structure and electronic device utilizing the same Grant 9,137,928 - Chen , et al. September 15, 2	2015-09-15
Planar Heat Dissipation Structure And Electronic Device Utilizing The Same App 20140009891 - CHEN; WEN-CHI ; et al.	2014-01-09
Heat Dissipation Structure And Electronic Device With The Same App 20130188318 - I; Ya-Tung ; et al.	2013-07-25
Heat Dissipation And Temperature-homogenizing Structure And Electronic Device Having The Same App 20120147565 - I; Ya-Tung ; et al.	2012-06-14
Power Supply Having Breathable Water Repelling Membrane Structure App 20110253413 - LU; Yi-Jen ; et al.	2011-10-20
Light-emitting keyboard App 20090128496 - Huang; Chen-Hua ; et al.	2009-05-21
Assembly structure for assembling a first plastic shell and a second plastic shell Grant 7,486,500 - I February 3, 2	2009-02-03
Assembly structure App 20060053623 - I; Ya-Tung	2006-03-16

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