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Patent applications and USPTO patent grants for Hyun; Songwon.The latest application filed is for "epoxy compound, composition prepared therefrom, semiconductor device prepared therefrom, electronic device prepared therefrom, article prepared therefrom, and method of preparing epoxy compound".
Patent | Date |
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Epoxy Compound, Composition Prepared Therefrom, Semiconductor Device Prepared Therefrom, Electronic Device Prepared Therefrom, Article Prepared Therefrom, And Method Of Preparing Epoxy Compound App 20220185947 - Noh; Changho ;   et al. | 2022-06-16 |
High-thermal Conductive Epoxy Compound And Composition, Material For Semiconductor Package, Molded Product, Electric And Electronic Device, And Semiconductor Package Including The Same App 20210147612 - Pang; Kyeong ;   et al. | 2021-05-20 |
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