HYODO; Tomoya
Patent Applications and Registrations
Patent applications and USPTO patent grants for HYODO; Tomoya.The latest application filed is for "layered food packaging system, temperary placement apparatus, and carrier device".
- HYODO; Tomoya - Fukuoka JP
- Hyodo; Tomoya - Kitakyushu JP
- Hyodo; Tomoya - Kitakyushu-shi JP
| Patent | Date |
|---|---|
| Layered Food Packaging System, Temperary Placement Apparatus, And Carrier Device App 20210371136 - KOIKE; Haruhiko ; et al. | 2021-12-02 |
| Layered food packaging system, laminate maker, and carrier Grant 11,027,864 - Hyodo , et al. June 8, 2 | 2021-06-08 |
| Container Supply Device And Container Supply Method App 20210139258 - KIRIHARA; Koichi ; et al. | 2021-05-13 |
| Triangle Sandwich Packaging Machine And Method Of Packaging Triangle Sandwich App 20190070820 - Noda; Tomohiro ; et al. | 2019-03-07 |
| Layered Food Packaging System, Laminate Maker, And Carrier App 20190071195 - HYODO; Tomoya ; et al. | 2019-03-07 |
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