Hyde-Smith; Peter K.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hyde-Smith; Peter K..The latest application filed is for "method of filling a seam of a panel assembly using a thixotropic polyurethane elastomeric filler adhesive".
- Hyde-Smith; Peter K. - Mayville MI
| Patent | Date |
|---|---|
| Method of filling a seam of a panel assembly using a thixotropic polyurethane elastomeric filler adhesive Grant 5,810,956 - Tanis , et al. September 22, 1 | 1998-09-22 |
| Landfill cap and method of sealing landfill Grant 5,562,586 - Hyde-Smith October 8, 1 | 1996-10-08 |
| Method for the repair of existing manholes using elastomeric materials Grant 5,415,499 - Hyde-Smith , et al. May 16, 1 | 1995-05-16 |
| Method for the repair of existing manholes using elastomeric materials Grant 5,405,218 - Hyde-Smith April 11, 1 | 1995-04-11 |
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