Hwee; Tan Kim

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hwee; Tan Kim.The latest application filed is for "wire bond and redistribution layer process".

Company Profile

0.6.7

Hwee; Tan Kim - Jiangyin CN
Hwee; Tan Kim - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wire bond and redistribution layer process Grant 7,781,870 - Hamamoto , et al. August 24, 2	2010-08-24
Wire Bond And Redistribution Layer Process App 20090236690 - Hamamoto; Mitchell M. ; et al.	2009-09-24
Package design and method of manufacture for chip grid array Grant 7,456,496 - Hwee , et al. November 25, 2	2008-11-25
Package design and method of manufacture for chip grid array App 20050205987 - Hwee, Tan Kim ; et al.	2005-09-22
Package design and method of manufacture for chip grid array Grant 6,929,981 - Hwee , et al. August 16, 2	2005-08-16
Flip chip package using no-flow underfill and method of fabrication App 20050087883 - Hwee, Tan Kim ; et al.	2005-04-28
Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip Grant 6,750,082 - Briar , et al. June 15, 2	2004-06-15
Semiconductor chip grid array package design and method of manufacture Grant 6,734,039 - Hwee , et al. May 11, 2	2004-05-11
Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip App 20040053445 - Briar, John ; et al.	2004-03-18
Semiconductor chip grid array package design and method of manufacture App 20040046238 - Hwee, Tan Kim ; et al.	2004-03-11
Package design and method of manufacture for chip grid array App 20040046257 - Hwee, Tan Kim ; et al.	2004-03-11
Method for forming a flip chip semiconductor package Grant 6,510,976 - Hwee , et al. January 28, 2	2003-01-28
Method For Forming A Flip Chip Semiconductor Package App 20020170942 - Hwee, Tan Kim ; et al.	2002-11-21

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