loadpatents
name:-0.016363143920898
name:-0.0070550441741943
name:-0.0032548904418945
HWANG; Taewook Patent Filings

HWANG; Taewook

Patent Applications and Registrations

Patent applications and USPTO patent grants for HWANG; Taewook.The latest application filed is for "abrasive article and method of use".

Company Profile
2.8.12
  • HWANG; Taewook - Acton MA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Abrasive Article And Method Of Use
App 20220203502 - MEJEAN; Cecile O. ;   et al.
2022-06-30
Bonded Abrasive Article And Method Of Making The Same
App 20220009056 - MEJEAN; Cecile O. ;   et al.
2022-01-13
Abrasive articles and method of forming same
Grant 10,213,902 - Sivasubramanian , et al. Feb
2019-02-26
Abrasive Articles And Method Of Forming Same
App 20170008153 - Sivasubramanian; Shivshankar ;   et al.
2017-01-12
Abrasive tool for use as a chemical mechanical planarization pad conditioner
Grant 9,022,840 - Dinh-Ngoc , et al. May 5, 2
2015-05-05
Corrosion-resistant CMP conditioning tools and methods for making and using same
Grant 8,905,823 - Wu , et al. December 9, 2
2014-12-09
Optimized CMP conditioner design for next generation oxide/metal CMP
Grant 8,657,652 - Hwang , et al. February 25, 2
2014-02-25
Tool For Use With Dual-sided Chemical Mechanical Planarization Pad Conditioner
App 20130316630 - ROTHENBERG; Michael ;   et al.
2013-11-28
Abrasive Tool For Use As A Chemical Mechanical Planarization Pad Conditioner
App 20130078895 - Dinh-Ngoc; Charles ;   et al.
2013-03-28
Abrasive tool for use as a chemical mechanical planarization pad conditioner
Grant 8,342,910 - Dinh-Ngoc , et al. January 1, 2
2013-01-01
Conditioning Tools and Techniques for Chemical Mechanical Planarization
App 20120060426 - PUTHANANGADY; Thomas ;   et al.
2012-03-15
Corrosion-Resistant CMP Conditioning Tools and Methods for Making and Using Same
App 20100330886 - Wu; Jianhui ;   et al.
2010-12-30
Abrasive Tool For Use As A Chemical Mechanical Planarization Pad Conditioner
App 20100248595 - Dinh-Ngoc; Charles ;   et al.
2010-09-30
Optimized CMP Conditioner Design for Next Generation Oxide/Metal CMP
App 20090053980 - Hwang; Taewook ;   et al.
2009-02-26
Conditioning Tools And Techniques For Chemical Mechanical Planarization
App 20080271384 - Puthanangady; Thomas ;   et al.
2008-11-06

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed