loadpatents
name:-0.015652894973755
name:-0.011658906936646
name:-0.0046689510345459
HWANG; Suhyung Patent Filings

HWANG; Suhyung

Patent Applications and Registrations

Patent applications and USPTO patent grants for HWANG; Suhyung.The latest application filed is for "package with a substrate comprising pad-on-pad interconnects".

Company Profile
4.7.15
  • HWANG; Suhyung - Rancho Mission Viejo CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Package With A Substrate Comprising Pad-on-pad Interconnects
App 20220310488 - FANG; Kun ;   et al.
2022-09-29
Package with substrate comprising variable thickness solder resist layer
Grant 11,439,008 - Fang , et al. September 6, 2
2022-09-06
Device comprising multi-directional antennas coupled through a flexible printed circuit board
Grant 11,399,435 - Yeon , et al. July 26, 2
2022-07-26
Sub-module L-shaped Millimeter Wave Antenna-in-package
App 20220131281 - SHAH; Milind ;   et al.
2022-04-28
Substrate Comprising Interconnects Embedded In A Solder Resist Layer
App 20220115312 - FANG; Kun ;   et al.
2022-04-14
Substrate Comprising Interconnects Embedded In A Solder Resist Layer
App 20220068662 - FANG; Kun ;   et al.
2022-03-03
Asymmetric antenna structure
Grant 11,258,165 - We , et al. February 22, 2
2022-02-22
Package With Substrate Comprising Variable Thickness Solder Resist Layer
App 20220053639 - FANG; Kun ;   et al.
2022-02-17
Sub-module L-shaped millimeter wave antenna-in-package
Grant 11,239,573 - Shah , et al. February 1, 2
2022-02-01
Systems For Shielding Bent Signal Lines
App 20210410274 - Han; Jeahyeong ;   et al.
2021-12-30
Sub-module L-shaped Millimeter Wave Antenna-in-package
App 20210376493 - SHAH; Milind ;   et al.
2021-12-02
X.5 layer substrate
Grant 11,183,446 - Yeon , et al. November 23, 2
2021-11-23
Multi-core Broadband Pcb Antenna
App 20210351488 - ZHANG; Chaoqi ;   et al.
2021-11-11
Device Comprising Multi-directional Antennas Coupled Through A Flexible Printed Circuit Board
App 20210345492 - YEON; Jaehyun ;   et al.
2021-11-04
Package comprising a substrate having a via wall configured as a shield
Grant 11,139,224 - Zhang , et al. October 5, 2
2021-10-05
Device Comprising Multi-directional Antennas In Substrates Coupled Through Flexible Interconnects
App 20210280959 - HAN; Jeahyeong ;   et al.
2021-09-09
Enhanced antenna module with shield layer
Grant 11,043,740 - Hwang , et al. June 22, 2
2021-06-22
Package Comprising A Substrate Having A Via Wall Configured As A Shield
App 20210175152 - ZHANG; Chaoqi ;   et al.
2021-06-10
Package Comprising Discrete Antenna Device
App 20210091017 - YEON; Jaehyun ;   et al.
2021-03-25
Enhanced Antenna Module with Flexible Portion
App 20210028539 - WE; Hong Bok ;   et al.
2021-01-28
Enhanced Antenna Module With Shield Layer
App 20200365983 - HWANG; Suhyung ;   et al.
2020-11-19
Asymmetric Antenna Structure
App 20200212545 - WE; Hong Bok ;   et al.
2020-07-02

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