| Patent | Date |
|---|
Integrated circuit device including through-silicon via structure and method of manufacturing the same
Grant 10,777,487 - Choi , et al. Sept | 2020-09-15 |
Integrated Circuit Device Including Through-silicon Via Structure And Method Of Manufacturing The Same
App 20190013260 - CHOI; Ju-il ; et al. | 2019-01-10 |
Integrated circuit device including through-silicon via structure and method of manufacturing the same
Grant 10,128,168 - Choi , et al. November 13, 2 | 2018-11-13 |
Plug Structure Of A Semiconductor Chip And Method Of Manufacturing The Same
App 20180122721 - HWANG; SON-KWAN ; et al. | 2018-05-03 |
Semiconductor Chips Having Through Silicon Vias And Related Fabrication Methods And Semiconductor Packages
App 20170345713 - Chun; Jin-ho ; et al. | 2017-11-30 |
Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages
Grant 9,698,051 - Chun , et al. July 4, 2 | 2017-07-04 |
Integrated circuit chips having vertically extended through-substrate vias therein
Grant 9,219,035 - Lee , et al. December 22, 2 | 2015-12-22 |
Integrated Circuit Device Including Through-silicon Via Structure And Method Of Manufacturing The Same
App 20150137387 - CHOI; Ju-il ; et al. | 2015-05-21 |
Semiconductor Chips Having Through Silicon Vias And Related Fabrication Methods And Semiconductor Packages
App 20150111346 - Chun; Jin-ho ; et al. | 2015-04-23 |
Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages
Grant 8,957,526 - Chun , et al. February 17, 2 | 2015-02-17 |
Method Of Fabricating Semiconductor Device Having Bump
App 20140329382 - HWANG; SON-KWAN ; et al. | 2014-11-06 |
Integrated Circuit Chips Having Vertically Extended Through-substrate Vias Therein
App 20140124901 - Lee; Ho-jin ; et al. | 2014-05-08 |
Methods of forming integrated circuit chips having vertically extended through-substrate vias therein
Grant 8,629,059 - Lee , et al. January 14, 2 | 2014-01-14 |
Through-silicon Via (tsv) Semiconductor Devices Having Via Pad Inlays
App 20130313722 - Hwang; Son-Kwan ; et al. | 2013-11-28 |
Semiconductor device having through silicon via (TSV)
Grant 8,564,102 - Choi , et al. October 22, 2 | 2013-10-22 |
Semiconductor Chips Having Through Silicon Vias and Related Fabrication Methods and Semiconductor Packages
App 20130264720 - Chun; Jin-ho ; et al. | 2013-10-10 |
Semiconductor Devices Including Dummy Solder Bumps
App 20130221519 - Hwang; Son-kwan ; et al. | 2013-08-29 |
Multi-chip package having semiconductor chips of different thicknesses from each other and related device
Grant 8,513,802 - Ma , et al. August 20, 2 | 2013-08-20 |
Wafer-level stack package and method of fabricating the same
Grant 8,482,129 - Lee , et al. July 9, 2 | 2013-07-09 |
Semiconductor chip, method of fabricating the same, and stack module and memory card including the same
Grant 8,415,804 - Lee , et al. April 9, 2 | 2013-04-09 |
Through-silicon via structures providing reduced solder spreading and methods of fabricating the same
Grant 8,183,673 - Hwang , et al. May 22, 2 | 2012-05-22 |
Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same
Grant 8,119,448 - Hwang , et al. February 21, 2 | 2012-02-21 |
Semiconductor Device And Method Of Fabricating The Same
App 20110284936 - CHOI; Ju-il ; et al. | 2011-11-24 |
Multi-Chip Package Having Semiconductor Chips Of Different Thicknesses From Each Other And Related Device
App 20110193229 - Ma; Keum-Hee ; et al. | 2011-08-11 |
Wafer-level Stack Package And Method Of Fabricating The Same
App 20110147946 - Lee; In-Young ; et al. | 2011-06-23 |
Chip stack package and method of fabricating the same
Grant 7,948,089 - Chung , et al. May 24, 2 | 2011-05-24 |
Semiconductor Chip, Wafer Stack Package Using The Same, And Methods Of Manufacturing The Same
App 20110097846 - HWANG; Son-Kwan ; et al. | 2011-04-28 |
Methods of Forming Integrated Circuit Chips Having Vertically Extended Through-Substrate Vias Therein
App 20110086486 - Lee; Ho-Jin ; et al. | 2011-04-14 |
Wafer-level stack package and method of fabricating the same
Grant 7,897,511 - Lee , et al. March 1, 2 | 2011-03-01 |
Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed thereby
Grant 7,875,552 - Lee , et al. January 25, 2 | 2011-01-25 |
Semiconductor Chip, Method Of Fabricating The Same, And Stack Module And Memory Card Including The Same
App 20100327422 - LEE; Ho-jin ; et al. | 2010-12-30 |
Wafer level package and method of fabricating the same
Grant 7,847,416 - Chung , et al. December 7, 2 | 2010-12-07 |
Semiconductor device having through electrode and method of fabricating the same
Grant 7,777,345 - Lee , et al. August 17, 2 | 2010-08-17 |
Through-silicon Via Structures Providing Reduced Solder Spreading And Methods Of Fabricating The Same
App 20100096753 - Hwang; Son-Kwan ; et al. | 2010-04-22 |
Methods of Forming Integrated Circuit Chips Having Vertically Extended Through-Substrate Vias Therein and Chips Formed Thereby
App 20090305502 - Lee; Ho-Jin ; et al. | 2009-12-10 |
Wafer Level Package And Method Of Fabricating The Same
App 20090267211 - CHUNG; Hyun-Soo ; et al. | 2009-10-29 |
Stack-type Semiconductor Package
App 20090085224 - CHOI; Ju-Il ; et al. | 2009-04-02 |
Semiconductor Device Having Through Electrode And Method Of Fabricating The Same
App 20090008790 - LEE; Ho-Jin ; et al. | 2009-01-08 |
Chip Stack Package And Method Of Fabricating The Same
App 20080251939 - Chung; Hyun-Soo ; et al. | 2008-10-16 |
Semiconductor Package Having Wire Redistribution Layer And Method Of Fabricating The Same
App 20080230877 - Chung; Hyun-soo ; et al. | 2008-09-25 |
Wafer-level Stack Package And Method Of Fabricating The Same
App 20080230912 - Lee; In-Young ; et al. | 2008-09-25 |
Wafer Level Package And Method Of Fabricating The Same
App 20070269931 - Chung; Hyun-Soo ; et al. | 2007-11-22 |
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