Hwang; Ming-Hang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hwang; Ming-Hang.The latest application filed is for "adhesion material structure and process method thereof".

Company Profile

0.2.11

Hwang; Ming-Hang - Taipei TW
Hwang; Ming-Hang - Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed circuit board structure and manufacturing method thereof Grant 7,504,148 - Hwang , et al. March 17, 2	2009-03-17
Chip heat dissipation structure and manufacturing method Grant 7,427,807 - Hwang , et al. September 23, 2	2008-09-23
Surface Coating Film Structure on Heat Dissipation Metal and Manufacturing Method Thereof App 20070199678 - Hwang; Ming-Hang ; et al.	2007-08-30
Dissipation Heat Pipe Structure and Manufacturing Method Thereof App 20070199681 - Hwang; Ming-Hang ; et al.	2007-08-30
Chip Heat Dissipation System and Manufacturing Method and Structure of Heat Dissipation Device Thereof App 20070199679 - Hwang; Ming-Hang ; et al.	2007-08-30
Dissipation Heat Pipe Structure and Manufacturing Method Thereof App 20070199682 - Hwang; Ming-Hang ; et al.	2007-08-30
Heat Sink Fin Structure and Manufacturing Method Thereof App 20070199677 - Hwang; Ming-Hang ; et al.	2007-08-30
Adhesion Material Structure and Process Method Thereof App 20070201203 - Hwang; Ming-Hang ; et al.	2007-08-30
Chip Heat Dissipation System and Structure of Heat Exchange Device and Manufacturing Method Thereof App 20070201207 - Hwang; Ming-Hang ; et al.	2007-08-30
Heat Conduction Interface Method and Manufacturing Method Thereof App 20060255451 - Hwang; Ming-Hang ; et al.	2006-11-16
Printed Circuit Board Structure and Manufacturing Method Thereof App 20060257664 - Hwang; Ming-Hang ; et al.	2006-11-16
Air Blown Chip Dissipation Device and Manufacturing Method Thereof App 20060256528 - Hwang; Ming-Hang ; et al.	2006-11-16
Chip heat dissipation structure and manufacturing method App 20060205118 - Hwang; Ming-Hang ; et al.	2006-09-14

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