Hwang; Lih-Tyng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hwang; Lih-Tyng.The latest application filed is for "vital sign sensor capable of resisting clutter".

Company Profile

2.10.9

Hwang; Lih-Tyng - Kaohsiung TW
Hwang; Lih-Tyng - Kaohsiung City TW
Hwang; Lih-Tyng - Crystal Lake IL
Hwang; Lih-Tyng - Phoenix AZ
Hwang; Lih-Tyng - Durham NC
Hwang; Lih-Tyng - Raleigh NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Vital sign sensor capable of resisting clutter Grant 10,816,656 - Wang , et al. October 27, 2	2020-10-27
Vital Sign Sensor Capable Of Resisting Clutter App 20190377080 - Wang; Fu-Kang ; et al.	2019-12-12
System And Method For Directing Communications Within A Heterogeneous Network Environment App 20100287273 - Nasir; Irfan ; et al.	2010-11-11
System And Method For Integrating Multiple Radios Of Different Protocols App 20090161728 - NASIR; Irfan ; et al.	2009-06-25
Micro-electro-mechanical system varactor Grant 7,499,257 - Lempkowski , et al. March 3, 2	2009-03-03
Micro-Electro-Mechanical System Varactor App 20080315362 - Lempkowski; Robert B. ; et al.	2008-12-25
Apparatus and methods relating to electrically conductive path interfaces disposed within capacitor plate openings Grant 7,463,113 - Tungare , et al. December 9, 2	2008-12-09
Event Handling Within Multi-modal Short Range Wireless Networks App 20080159280 - Hwang; Lih-Tyng ; et al.	2008-07-03
Apparatus And Methods Relating To Electrically Conductive Path Interfaces Disposed Within Capacitor Plate Openings App 20080013251 - Tungare; Aroon V. ; et al.	2008-01-17
Embedded multilayer printed circuit Grant 7,136,274 - Hwang , et al. November 14, 2	2006-11-14
Embedded Multilayer Printed Circuit App 20060092594 - Hwang; Lih-Tyng ; et al.	2006-05-04
Multiple dice package Grant 6,906,406 - Hwang , et al. June 14, 2	2005-06-14
Current-carrying electronic component and method of manufacturing same Grant 6,841,736 - Hwang , et al. January 11, 2	2005-01-11
Multiple dice package App 20040119150 - Hwang, Lih-Tyng ; et al.	2004-06-24
Current-carrying electronic component and method of manufacturing same App 20040060724 - Hwang, Lih-Tyng ; et al.	2004-04-01
Bonding structure for an electronic device Grant 5,912,510 - Hwang , et al. June 15, 1	1999-06-15
Process for electrically connecting electrical devices using a conductive anisotropic material Grant 5,661,042 - Fang , et al. August 26, 1	1997-08-26
High performance integrated circuit chip package Grant 5,325,265 - Turlik , et al. June 28, 1	1994-06-28
Apparatus for mounting a semiconductor chip and making electrical connections thereto Grant 4,774,630 - Reisman , et al. September 27, 1	1988-09-27

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