Hwang; Kyu-Pyung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hwang; Kyu-Pyung.The latest application filed is for "method for high-intensity radiated field (hirf) and electromagnetic pulse (emp) analysis of a vehicle".

Company Profile

10.36.51

Hwang; Kyu-Pyung - Ladson SC
Hwang; Kyu-Pyung - Newton MA
Hwang; Kyu-Pyung - San Diego CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for high-intensity radiated field (HIRF) and electromagnetic pulse (EMP) analysis of a vehicle Grant 11,378,605 - Hwang , et al. July 5, 2	2022-07-05
Fire suppressing device Grant 11,191,983 - Hwang , et al. December 7, 2	2021-12-07
Methods of manufacturing a high impedance surface (HIS) enhanced by discrete passives Grant 11,071,213 - Muwonge , et al. July 20, 2	2021-07-20
Method For High-intensity Radiated Field (hirf) And Electromagnetic Pulse (emp) Analysis Of A Vehicle App 20210215748 - Hwang; Kyu-Pyung ; et al.	2021-07-15
High impedance surface (HIS) enhanced by discrete passives Grant 11,038,277 - Muwonge , et al. June 15, 2	2021-06-15
Thin film resistor having surface mounted trimming bridges for incrementally tuning resistance Grant 10,980,122 - Hwang , et al. April 13, 2	2021-04-13
Thin Film Resistor Having Surface Mounted Trimming Bridges For Incrementally Tuning Resistance App 20210068256 - Hwang; Kyu-Pyung ; et al.	2021-03-04
Methods Of Manufacturing A High Impedance Surface (his) Enhanced By Discrete Passives App 20210029836 - Muwonge; Charles ; et al.	2021-01-28
High Impedance Surface (his) Enhanced By Discrete Passives App 20210028550 - Muwonge; Charles ; et al.	2021-01-28
Variable radio frequency attenuator Grant 10,903,542 - Al-Bondak , et al. January 26, 2	2021-01-26
Electrical Module Assembly With Embedded Dies App 20200388560 - Song; Young Kyu ; et al.	2020-12-10
Fire Suppressing Device App 20200147424 - Hwang; Kyu-Pyung ; et al.	2020-05-14
Thin film resistor having surface mounted trimming bridges for incrementally tuning resistance Grant 10,653,013 - Hwang , et al.	2020-05-12
Integrated Circuit Package Comprising Surface Capacitor And Ground Plane App 20190057880 - SONG; Young Kyu ; et al.	2019-02-21
Integrated circuit package comprising surface capacitor and ground plane Grant 10,181,410 - Song , et al. Ja	2019-01-15
Capacitor structure for power delivery applications Grant 10,079,097 - Song , et al. September 18, 2	2018-09-18
Semiconductor package on package structure and method of forming the same Grant 10,049,977 - We , et al. August 14, 2	2018-08-14
Known good die testing for high frequency applications Grant 9,933,455 - Song , et al. April 3, 2	2018-04-03
Low profile reinforced package-on-package semiconductor device Grant 9,875,997 - We , et al. January 23, 2	2018-01-23
Capacitor structure for wideband resonance suppression in power delivery networks Grant 9,837,209 - Hwang , et al. December 5, 2	2017-12-05
Substrate comprising embedded elongated capacitor Grant 9,807,884 - Hwang , et al. October 31, 2	2017-10-31
Package substrate comprising capacitor, redistribution layer and discrete coaxial connection Grant 9,659,850 - We , et al. May 23, 2	2017-05-23
Integrated Circuit Package Comprising Surface Capacitor And Ground Plane App 20170125332 - Song; Young Kyu ; et al.	2017-05-04
Embedded multi-terminal capacitor Grant 9,628,052 - We , et al. April 18, 2	2017-04-18
Integrated device package and/or system comprising configurable directional optical transmitter Grant 9,621,281 - Hwang April 11, 2	2017-04-11
Interposer for a package-on-package structure Grant 9,613,942 - Lee , et al. April 4, 2	2017-04-04
Integrated device package comprising conductive sheet configured as an inductor in an encapsulation layer Grant 9,583,433 - Song , et al. February 28, 2	2017-02-28
Package on package (PoP) device comprising a high performance inter package connection Grant 9,530,739 - Song , et al. December 27, 2	2016-12-27
Capacitor Structure For Power Delivery Applications App 20160365196 - SONG; Young Kyu ; et al.	2016-12-15
Interposer For A Package-on-package Structure App 20160358899 - LEE; Jae Sik ; et al.	2016-12-08
Embedded package substrate capacitor Grant 9,502,490 - We , et al. November 22, 2	2016-11-22
Embedded sheet capacitor Grant 9,502,491 - Song , et al. November 22, 2	2016-11-22
Known Good Die Testing For High Frequency Applications App 20160327590 - Song; Young Kyu ; et al.	2016-11-10
Integrated device comprising a heat-dissipation layer providing an electrical path for a ground signal Grant 9,490,226 - Song , et al. November 8, 2	2016-11-08
Integrated Device Package Comprising An Electromagnetic (em) Passive Device In An Encapsulation Layer, And An Em Shield App 20160322300 - Song; Young Kyu ; et al.	2016-11-03
Power distribution improvement using pseudo-ESR control of an embedded passive capacitor Grant 9,472,425 - Song , et al. October 18, 2	2016-10-18
Power Distribution Improvement Using Pseudo-esr Control Of An Embedded Passive Capacitor App 20160276173 - SONG; Young Kyu ; et al.	2016-09-22
Embedded package substrate capacitor with configurable/controllable equivalent series resistance Grant 9,449,762 - Song , et al. September 20, 2	2016-09-20
Integrated Device Package Comprising Conductive Sheet Configured As An Inductor In An Encapsulation Layer App 20160247761 - Song; Young Kyu ; et al.	2016-08-25
Integrated device package comprising an electromagnetic (EM) passive device in an encapsulation layer, and an EM shield Grant 9,425,143 - Song , et al. August 23, 2	2016-08-23
Package-on-package (pop) Structure App 20160225748 - We; Hong Bok ; et al.	2016-08-04
Integrated device comprising coaxial interconnect Grant 9,385,077 - Kim , et al. July 5, 2	2016-07-05
Techniques For Controlling Equivalent Series Resistance Of A Capacitor App 20160183386 - SONG; Young Kyu ; et al.	2016-06-23
Substrate Comprising An Embedded Capacitor App 20160183379 - Song; Young Kyu ; et al.	2016-06-23
Substrate Comprising Embedded Elongated Capacitor App 20160183378 - Hwang; Kyu-Pyung ; et al.	2016-06-23
Package On Package (pop) Device Comprising A High Performance Inter Package Connection App 20160172302 - Song; Young Kyu ; et al.	2016-06-16
Low Profile Reinforced Package-on-package Semiconductor Device App 20160172344 - WE; Hong Bok ; et al.	2016-06-16
Package Substrate Comprising Capacitor, Redistribution Layer And Discrete Coaxial Connection App 20160163628 - We; Hong Bok ; et al.	2016-06-09
Semiconductor package interconnections and method of making the same Grant 9,355,963 - Kim , et al. May 31, 2	2016-05-31
Integrated Device Package And/or System Comprising Configurable Directional Optical Transmitter App 20160142156 - Hwang; Kyu-Pyung	2016-05-19
Integrated Device Package Comprising Silicon Bridge In Photo Imageable Layer App 20160141234 - We; Hong Bok ; et al.	2016-05-19
Integrated Device Package Comprising An Electromagnetic (em) Passive Device In An Encapsulation Layer, And An Em Shield App 20160141244 - Song; Young Kyu ; et al.	2016-05-19
Adjustable magnetic probe for efficient near field scanning Grant 9,335,384 - Hwang , et al. May 10, 2	2016-05-10
Semiconductor Package Interconnections And Method Of Making The Same App 20160093571 - KIM; Dong Wook ; et al.	2016-03-31
Flexible Film Electrical-test Substrates With Conductive Coupling Post(s) For Integrated Circuit (ic) Bump(s) Electrical Testing, And Related Methods And Testing Apparatuses App 20160091532 - Song; Young Kyu ; et al.	2016-03-31
Bandpass filter implementation on a single layer using spiral capacitors Grant 9,294,064 - Song , et al. March 22, 2	2016-03-22
Stiffener with embedded passive components Grant 9,275,876 - Kim , et al. March 1, 2	2016-03-01
Package Substrates Including Embedded Capacitors App 20160055976 - Song; Young Kyu ; et al.	2016-02-25
Wafer Level Package (wlp) Integrated Device Comprising Electromagnetic (em) Passive Device In Redistribution Portion, And Radio Frequency (rf) Shield App 20160056226 - Song; Young Kyu ; et al.	2016-02-25
Pattern between pattern for low profile substrate Grant 9,269,610 - We , et al. February 23, 2	2016-02-23
Integrated Device Comprising A Heat-dissipation Layer Providing An Electrical Path For A Ground Signal App 20160049378 - Song; Young Kyu ; et al.	2016-02-18
Fishbone Lc Component And Method Of Making The Same App 20160049458 - SONG; Young Kyu ; et al.	2016-02-18
Semiconductor Package On Package Structure And Method Of Forming The Same App 20160035664 - WE; Hong Bok ; et al.	2016-02-04
Precision Resistor Tuning And Testing By Inkjet Technology App 20160027562 - FENG; Yuan ; et al.	2016-01-28
Integrated Device Comprising Coaxial Interconnect App 20160013125 - Kim; Dong Wook ; et al.	2016-01-14
Embedded Package Substrate Capacitor App 20150340425 - We; Hong Bok ; et al.	2015-11-26
Embedded Package Substrate Capacitor With Configurable/controllable Equivalent Series Resistance App 20150325375 - Song; Young Kyu ; et al.	2015-11-12
Embedded Sheet Capacitor App 20150311275 - Song; Young Kyu ; et al.	2015-10-29
Pattern Between Pattern For Low Profile Substrate App 20150294933 - We; Hong Bok ; et al.	2015-10-15
Ceramic Interposer Capacitor App 20150294791 - Hwang; Kyu-Pyung ; et al.	2015-10-15
Reconfigurable electric field probe Grant 9,151,779 - Hwang , et al. October 6, 2	2015-10-06
Embedded Multi-terminal Capacitor App 20150236681 - We; Hong Bok ; et al.	2015-08-20
Embedded sheet capacitor Grant 9,093,295 - Song , et al. July 28, 2	2015-07-28
Low Cost Connector For High Speed, High Density Signal Delivery App 20150187731 - KIM; Dong Wook ; et al.	2015-07-02
Multilayer Ceramic Capacitor Including At Least One Slot App 20150146340 - Yun; Changhan Hobie ; et al.	2015-05-28
Thermal design and electrical routing for multiple stacked packages using through via insert (TVI) Grant 9,041,212 - Kim , et al. May 26, 2	2015-05-26
Embedded Sheet Capacitor App 20150130024 - Song; Young Kyu ; et al.	2015-05-14
Stiffener With Embedded Passive Components App 20150091132 - KIM; Dong Wook ; et al.	2015-04-02
Adjustable Magnetic Probe For Efficient Near Field Scanning App 20150084623 - HWANG; Kyu-Pyung ; et al.	2015-03-26
Current Source Driven Measurement And Modeling App 20150084653 - Song; Young K. ; et al.	2015-03-26
Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages Grant 8,987,872 - Hwang , et al. March 24, 2	2015-03-24
Bandpass Filter Implementation On A Single Layer Using Spiral Capacitors App 20140266508 - Song; Young Kyu ; et al.	2014-09-18
Electromagnetic Interference Enclosure For Radio Frequency Multi-chip Integrated Circuit Packages App 20140252568 - Hwang; Kyu-Pyung ; et al.	2014-09-11
Thermal Design And Electrical Routing For Multiple Stacked Packages Using Through Via Insert (tvi) App 20140252645 - Kim; Dong Wook ; et al.	2014-09-11
Low Parasitic Package Substrate Having Embedded Passive Substrate Discrete Components And Method For Making Same App 20140167273 - Kim; Jonghae ; et al.	2014-06-19
Capacitor Structure For Wideband Resonance Suppression In Power Delivery Networks App 20140139969 - Hwang; Kyu-Pyung ; et al.	2014-05-22
Reconfigurable Electric Field Probe App 20140132297 - Hwang; Kyu-Pyung ; et al.	2014-05-15

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