Hwang; Jenn-Dong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hwang; Jenn-Dong.The latest application filed is for "multi-layer thermoelectric module and method for fabricating the same".

Company Profile

0.6.11

Hwang; Jenn-Dong - Hsinchu TW
Hwang; Jenn-Dong - Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermoelectric material and method for manufacturing the same Grant 9,123,857 - Chu , et al. September 1, 2	2015-09-01
Multi-layer thermoelectric module and method for fabricating the same Grant 9,048,388 - Huang , et al. June 2, 2	2015-06-02
Multi-layer Thermoelectric Module And Method For Fabricating The Same App 20140305483 - HUANG; Jing-Yi ; et al.	2014-10-16
Protection structure forthermal dissipation and preventing thermal runaway diffusion in battery system Grant 8,785,026 - Hu , et al. July 22, 2	2014-07-22
Thermoelectric Material And Method For Manufacturing The Same App 20140174492 - Chu; Hsu-Shen ; et al.	2014-06-26
Thermoelectric Generator And Thermoelectric Generating System App 20140158178 - Wong; Cheng-Chou ; et al.	2014-06-12
Solid-liquid Interdiffusion Bonding Structure Of Thermoelectric Module And Fabricating Method Thereof App 20130152990 - Lai; Hong-Jen ; et al.	2013-06-20
Thermally conductive, electrically insulating composite film and stack chip package structure utilizing the same Grant 8,242,372 - Leu , et al. August 14, 2	2012-08-14
Thermoelectric Module And Method Of Manufacturing The Same App 20120167937 - Fann; Yuan-Chang ; et al.	2012-07-05
Thermoelectric Generator Apparatus With High Thermoelectric Conversion Efficiency App 20120132242 - Chu; Hsu-Shen ; et al.	2012-05-31
Protection Structure Forthermal Dissipation And Preventing Thermal Runaway Diffusion In Battery System App 20110159340 - Hu; Hsien-Lin ; et al.	2011-06-30
Thermally Conductive, Electrically Insulating Composite Film And Stack Chip Package Structure Utilizing The Same App 20110149521 - Leu; Ming-Sheng ; et al.	2011-06-23
Melting temperature adjustable metal thermal interface materials and packaged semiconductors including thereof Grant 7,952,192 - Fann , et al. May 31, 2	2011-05-31
Carbon-Containing Metal-Based Composite Material and Manufacturing Method Thereof App 20100163782 - Chang; Chih-Chung ; et al.	2010-07-01
Melting Temperature Adjustable Metal Thermal Interface Materials And Packaged Semiconductors Including Thereof App 20090236729 - Fann; Yuan-Chang ; et al.	2009-09-24

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