Hwang; Jeng-Jyi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hwang; Jeng-Jyi.The latest application filed is for "ph-adjuster free chemical mechanical planarization slurry".

Company Profile

0.5.8

Hwang; Jeng-Jyi - Chu-Tong Town TW
Hwang; Jeng-Jyi - Chu-Tong Township TW
HWANG; Jeng-Jyi - Hsin-Chu County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-point chemical mechanical polishing end point detection system and method of using Grant 10,090,207 - Wu , et al. October 2, 2	2018-10-02
pH-adjuster free chemical mechanical planarization slurry Grant 10,035,929 - Huang , et al. July 31, 2	2018-07-31
Method of identifying airborne molecular contamination source Grant 9,958,424 - Chuang , et al. May 1, 2	2018-05-01
Apparatus and method of cleaning wafers Grant 9,691,641 - Huang , et al. June 27, 2	2017-06-27
pH-ADJUSTER FREE CHEMICAL MECHANICAL PLANARIZATION SLURRY App 20170152402 - Huang; Shu-Hao ; et al.	2017-06-01
Wafer Particle Removal App 20150107619 - Wu; Jiann Lih ; et al.	2015-04-23
Method And Device For Cleaning A Brush Surface Having A Contamination App 20140196744 - WU; Jiann-Lih ; et al.	2014-07-17
Apparatus And Method Of Cleaning Wafers App 20140166055 - HUANG; Chia-Hung ; et al.	2014-06-19
Multi-point Chemical Mechanical Polishing End Point Detection System And Method Of Using App 20140148008 - WU; Jiann Lih ; et al.	2014-05-29
Method Of Identifying Airborne Molecular Contamination Source App 20140095083 - Chuang; Tzu-Sou ; et al.	2014-04-03

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