Hwang; Jen-Dong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hwang; Jen-Dong.The latest application filed is for "metal thermal interface material and thermal module and packaged microelectronic component containing the material".

Company Profile

0.5.5

Hwang; Jen-Dong - Hsinchu TW
Hwang; Jen-Dong - Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal thermal interface material and thermal module and packaged microelectronic component containing the material Grant 8,373,991 - Fann , et al. February 12, 2	2013-02-12
Electrically conductive composite Grant 8,197,714 - Yen , et al. June 12, 2	2012-06-12
Melting temperature adjustable metal thermal interface materials and application thereof Grant 7,576,428 - Fann , et al. August 18, 2	2009-08-18
Metal Thermal Interface Material And Thermal Module And Packaged Microelectronic Component Containing The Material App 20090135567 - Fann; Yuan-Chang ; et al.	2009-05-28
Melting Temperature Adjustable Metal Thermal Interface Materials And Application Thereof App 20080110609 - Fann; Yuan-Chang ; et al.	2008-05-15
Electrically conductive composite App 20070224488 - Yen; Min-Yu ; et al.	2007-09-27
Heat dissipation device and composite material with high thermal conductivity App 20070053166 - Hwang; Jen-Dong ; et al.	2007-03-08
Aluminum die casting alloy App 20010043880 - Hwang, Jen-Dong ; et al.	2001-11-22
Heat dissipation device Grant 6,179,046 - Hwang , et al. January 30, 2	2001-01-30

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.