HWANG; Hyunsu
Patent Applications and Registrations
Patent applications and USPTO patent grants for HWANG; Hyunsu.The latest application filed is for "interconnection structure and semiconductor package including the same".
- HWANG; Hyunsu - Siheung-si KR
- Hwang; Hyunsu - Gyeonggi-do KR
| Patent | Date |
|---|---|
| Interconnection Structure And Semiconductor Package Including The Same App 20220068779 - KWEON; Junyun ; et al. | 2022-03-03 |
| Interconnection Structure And Semiconductor Package Including The Same App 20220059442 - OH; Dongjoon ; et al. | 2022-02-24 |
| Semiconductor Package And Method Of Fabricating The Same App 20220037255 - Hwang; Hyunsu ; et al. | 2022-02-03 |
| Semiconductor Package App 20220037261 - CHOI; Ju-Il ; et al. | 2022-02-03 |
| Semiconductor Device And Semiconductor Package Including The Same App 20210384137 - CHOI; Ju-IL ; et al. | 2021-12-09 |
| Method for estimating arrival time of wireless communication signal and computer-readable recording medium recording same Grant 11,109,337 - Eom , et al. August 31, 2 | 2021-08-31 |
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