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Patent applications and USPTO patent grants for Hwang; Hong-Sik.The latest application filed is for "alloy compositions and techniques for reducing intermetallic compound thicknesses and oxidation of metals and alloys".
Patent | Date |
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Alloy Compositions And Techniques For Reducing Intermetallic Compound Thicknesses And Oxidation Of Metals And Alloys App 20110273847 - Hwang; Hong-Sik ;   et al. | 2011-11-10 |
Technique for increasing the compliance of tin-indium solders Grant 7,749,336 - Huang , et al. July 6, 2 | 2010-07-06 |
Technique for increasing the compliance of lead-free solders containing silver Grant 7,749,340 - Huang , et al. July 6, 2 | 2010-07-06 |
Alloy Compositions And Techniques For Reducing Intermetallic Compound Thickness And Oxidation Of Metals And Alloys App 20070256761 - Hwang; Hong-Sik ;   et al. | 2007-11-08 |
Technique For Increasing The Compliance Of Lead-Free Solders Containing Silver App 20070092396 - Huang; Benlih ;   et al. | 2007-04-26 |
Low Melting Temperature Compliant Solders App 20070071634 - Huang; Benlih ;   et al. | 2007-03-29 |
Technique for increasing the compliance of tin-indium solders App 20070048172 - Huang; Benlih ;   et al. | 2007-03-01 |
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