HWANG; Ho-yung
Patent Applications and Registrations
Patent applications and USPTO patent grants for HWANG; Ho-yung.The latest application filed is for "tin oxide and tin carbide materials for semiconductor patterning applications".
- HWANG; Ho-yung - Cupertino CA
| Patent | Date |
|---|---|
| Tin Oxide And Tin Carbide Materials For Semiconductor Patterning Applications App 20220189786 - LIN; Yung-chen ; et al. | 2022-06-16 |
| Dose Reduction Of Patterned Metal Oxide Photoresists App 20210033974 - SINGH; Tejinder ; et al. | 2021-02-04 |
| Selectively etched self-aligned via processes Grant 10,840,138 - Lin , et al. November 17, 2 | 2020-11-17 |
| Methods of producing self-aligned grown via Grant 10,573,555 - Zhang , et al. Feb | 2020-02-25 |
| Methods of producing fully self-aligned vias and contacts Grant 10,553,485 - Zhang , et al. Fe | 2020-02-04 |
| Fully self-aligned via Grant 10,522,404 - Zhang , et al. Dec | 2019-12-31 |
| Fully Self-Aligned Via App 20190348323 - Zhang; Ying ; et al. | 2019-11-14 |
| Fully self-aligned via Grant 10,424,507 - Zhang , et al. Sept | 2019-09-24 |
| Multicolor Self-Aligned Contact Selective Etch App 20190279901 - Lin; Yung-Chen ; et al. | 2019-09-12 |
| Selectively Etched Self-aligned Via Processes App 20190088543 - Lin; Yung-Chen ; et al. | 2019-03-21 |
| Methods Of Producing Self-Aligned Vias App 20190074219 - Zhang; Ying ; et al. | 2019-03-07 |
| Methods Of Producing Self-aligned Grown Via App 20190067103 - Zhang; Ying ; et al. | 2019-02-28 |
| Mask Scheme For Cut Pattern Flow With Enlarged EPE Window App 20190019676 - Zhang; Ying ; et al. | 2019-01-17 |
| Methods Of Producing Fully Self-Aligned Vias And Contacts App 20180374750 - Zhang; Ying ; et al. | 2018-12-27 |
| Fully Self-Aligned Via App 20180286749 - Zhang; Ying ; et al. | 2018-10-04 |
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