loadpatents
name:-0.010333061218262
name:-0.00130295753479
name:-0.0014028549194336
Hwang; Ho Jin Patent Filings

Hwang; Ho Jin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hwang; Ho Jin.The latest application filed is for "method and apparatus for providing information about similar items based on machine learning".

Company Profile
1.1.12
  • Hwang; Ho Jin - Seoul KR
  • Hwang; Ho Jin - Suwon-si KR
  • HWANG; Ho-Jin - Dajeon KR
  • HWANG; Ho Jin - Daejeon KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method And Apparatus For Providing Information Based On Machine Learning
App 20220164705 - Song; Jae Min ;   et al.
2022-05-26
Method And Apparatus For Providing Information About Similar Items Based On Machine Learning
App 20220164851 - Song; Jae Min ;   et al.
2022-05-26
Method And Apparatus For Classifying Item Based On Machine Learning
App 20220164849 - Song; Jae Min ;   et al.
2022-05-26
Method And Apparatus For Providing Information Using Trained Model Based On Machine Learning
App 20220164850 - Song; Jae Min ;   et al.
2022-05-26
Coaxial Connector
App 20220109273 - Park; Nam Shin ;   et al.
2022-04-07
Coaxial connector
Grant 11,239,616 - Park , et al. February 1, 2
2022-02-01
Coaxial Connector
App 20200244018 - Park; Nam Shin ;   et al.
2020-07-30
Method Of Row Grouping And Data Management Server
App 20190050382 - HWANG; Ho Jin
2019-02-14
Apparatus And Method For Predicting Dispersion Of Hazardous And Noxious Substances
App 20180330064 - LEE; Moon Jin ;   et al.
2018-11-15
Integrated Solution For Simulation-based Production Of Ships And Offshore Plants
App 20180253085 - HWANG; Ho Jin
2018-09-06
Offshore Plant Preventive Maintenance System And Offshore Plant Preventing Maintenance Method Using The Same
App 20170132579 - HWANG; Ho Jin
2017-05-11
Inspection Device For Bonded Wafer Using Laser
App 20120314212 - Jang; Dong Young ;   et al.
2012-12-13
Inspection Method For Bonded Wafer Using Laser
App 20110122403 - JANG; Dong Young ;   et al.
2011-05-26

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