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Patent applications and USPTO patent grants for Hwang; Hee-don.The latest application filed is for "method of manufacturing integrated circuit device".
Patent | Date |
---|---|
Method of manufacturing integrated circuit device Grant 10,115,640 - Hwang , et al. October 30, 2 | 2018-10-30 |
Method Of Manufacturing Integrated Circuit Device App 20180025947 - Hwang; Hee-don ;   et al. | 2018-01-25 |
Semiconductor Device App 20150228786 - Yi; Wook-Yeol ;   et al. | 2015-08-13 |
Semiconductor trench isolation including polysilicon and nitride layers Grant 8,766,355 - Lee , et al. July 1, 2 | 2014-07-01 |
Semiconductor Trench Isolation Including Polysilicon And Nitride Layers App 20120056263 - Lee; Dong-kak ;   et al. | 2012-03-08 |
Methods of manufacturing semiconductor devices having a recessed-channel Grant 8,119,486 - Kim , et al. February 21, 2 | 2012-02-21 |
Methods Of Manufacturing Semiconductor Devices Having A Recessed-channel App 20110201168 - Kim; Young-Pil ;   et al. | 2011-08-18 |
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