Hwang; Hangyu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hwang; Hangyu.The latest application filed is for "electronic device including housing and method for manufacturing the housing".

Company Profile

3.2.9

Hwang; Hangyu - Suwon-si KR
HWANG; Hangyu - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Cover device for holding electronic device Grant 11,432,630 - Jeon , et al. September 6, 2	2022-09-06
Electronic Device Including Housing And Method For Manufacturing The Housing App 20220248551 - LEE; Yoonhee ; et al.	2022-08-04
Electronic Device Including Housing And Method For Manufacturing The Housing App 20220184868 - KIM; Changsu ; et al.	2022-06-16
Electronic Device Member Of Metallic Structure And Non-metallic Structure, And Method For Manufacturing Same App 20210347098 - KIM; Changsu ; et al.	2021-11-11
Electronic Device Including Metal Housing App 20210329799 - IM; Junghyun ; et al.	2021-10-21
Electronic Device Including Housing App 20210219438 - JUNG; Hyunjung ; et al.	2021-07-15
Housing, method of producing the same, and electronic device including the same Grant 11,058,015 - Hwang , et al. July 6, 2	2021-07-06
Cover Device For Holding Electronic Device App 20210120927 - JEON; Jongbae ; et al.	2021-04-29
Electronic Device Including Housing And Method Of Producing The Housing App 20210120681 - HWANG; Hangyu ; et al.	2021-04-22
Electronic Device Including Injection Structure, And Injection Mold Structure For Injection Structure App 20200288583 - KIM; Changsu ; et al.	2020-09-10
Housing, Method Of Producing The Same, And Electronic Device Including The Same App 20200236796 - HWANG; Hangyu ; et al.	2020-07-23

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