Hwang; Chien-Ling

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hwang; Chien-Ling.The latest application filed is for "package structure and manufacturing method thereof".

Company Profile

50.140.143

Hwang; Chien-Ling - Hsinchu City TW
Hwang; Chien-Ling - Hsinchu TW
Hwang; Chien Ling - Hsin-Chu TW
Hwang; Chien Ling - Hsin Chu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package Structure And Manufacturing Method Thereof App 20220293505 - Wu; Sung-Yueh ; et al.	2022-09-15
Package structure Grant 11,444,002 - Lai , et al. September 13, 2	2022-09-13
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same App 20220285310 - Yu; Chen-Hua ; et al.	2022-09-08
Semiconductor Package And Manufacturing Method Thereof App 20220278023 - Liao; Jen-Chun ; et al.	2022-09-01
Via structure for packaging and a method of forming Grant 11,410,953 - Ho , et al. August 9, 2	2022-08-09
Wafer level transfer molding and apparatus for performing the same Grant 11,390,000 - Jang , et al. July 19, 2	2022-07-19
Anisotropic carrier for high aspect ratio fanout Grant 11,393,701 - Yu , et al. July 19, 2	2022-07-19
Bonding with pre-deoxide process and apparatus for performing the same Grant 11,342,302 - Yu , et al. May 24, 2	2022-05-24
Aligning Bumps in Fan-Out Packaging Process App 20220130794 - Huang; Ying-Jui ; et al.	2022-04-28
Package structure and manufacturing method thereof Grant 11,289,418 - Hwang , et al. March 29, 2	2022-03-29
Integrated fan-out package and manufacturing method thereof Grant 11,282,810 - Wan , et al. March 22, 2	2022-03-22
Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same Grant 11,257,714 - Hwang , et al. February 22, 2	2022-02-22
Package Structure App 20220037228 - Lai; Yu-Chia ; et al.	2022-02-03
Mechanisms for forming bonding structures Grant 11,233,032 - Lin , et al. January 25, 2	2022-01-25
Aligning bumps in fan-out packaging process Grant 11,217,555 - Huang , et al. January 4, 2	2022-01-04
Electronic Device And Manufacturing Method Thereof App 20210351491 - Lee; Pei-Hsuan ; et al.	2021-11-11
Method of fabricating semiconductor package structure Grant 11,139,177 - Hwang , et al. October 5, 2	2021-10-05
Fan-out interconnect structure and method for forming same Grant 11,133,274 - Yu , et al. September 28, 2	2021-09-28
Integrated Circuit Package and Method App 20210265228 - Chun; Shu-Rong ; et al.	2021-08-26
Conductive micro pin Grant 11,101,232 - Huang , et al. August 24, 2	2021-08-24
Semiconductor package structure Grant 11,094,561 - Hwang , et al. August 17, 2	2021-08-17
Electronic device and manufacturing method thereof Grant 11,075,439 - Lee , et al. July 27, 2	2021-07-27
Wafer-level underfill and over-molding Grant 11,024,618 - Jang , et al. June 1, 2	2021-06-01
Integrated circuit package and method Grant 11,004,758 - Chun , et al. May 11, 2	2021-05-11
Methods for controlling warpage in packaging Grant 10,985,135 - Hwang , et al. April 20, 2	2021-04-20
Dam For Three-dimensional Integrated Circuit App 20210098318 - Wang; Tsung-Ding ; et al.	2021-04-01
Anisotropic Carrier for High Aspect Ratio Fanout App 20210050229 - Yu; Chen-Hua ; et al.	2021-02-18
Package structure and method of fabricating package structure Grant 10,879,197 - Wan , et al. December 29, 2	2020-12-29
Integrated Circuit Package and Method App 20200395257 - Chun; Shu-Rong ; et al.	2020-12-17
Dam for three-dimensional integrated circuit Grant 10,867,878 - Wang , et al. December 15, 2	2020-12-15
Mutli-chip package with encapsulated conductor via Grant 10,867,890 - Hwang , et al. December 15, 2	2020-12-15
Apparatus for holding semiconductor wafers Grant 10,867,832 - Yu , et al. December 15, 2	2020-12-15
Via Structure for Packaging and a Method of Forming App 20200365541 - Ho; Ming-Che ; et al.	2020-11-19
Method And System For Thinning Wafer Thereof App 20200357651 - HWANG; Chien-Ling ; et al.	2020-11-12
Integrated Fan-out Package And Manufacturing Method Thereof App 20200335477 - Wan; Albert ; et al.	2020-10-22
Fan-Out Interconnect Structure and Method for Forming Same App 20200328169 - Yu; Chen-Hua ; et al.	2020-10-15
Semiconductor device having a boundary structure, a package on package structure, and a method of making Grant 10,804,234 - Hwang , et al. October 13, 2	2020-10-13
Semiconductor Package Structure App 20200303214 - HWANG; Chien-Ling ; et al.	2020-09-24
Method Of Fabricating Semiconductor Package Structure App 20200303213 - HWANG; Chien-Ling ; et al.	2020-09-24
Package Structure And Manufacturing Method Thereof App 20200286825 - Hwang; Chien-Ling ; et al.	2020-09-10
Semiconductor wafer device and manufacturing method thereof Grant 10,770,331 - Jang , et al. Sep	2020-09-08
Method of manufacturing integrated fan-out package Grant 10,756,052 - Wan , et al. A	2020-08-25
Via structure for packaging and a method of forming Grant 10,734,341 - Ho , et al.	2020-08-04
Packaging through pre-formed metal pins Grant 10,734,345 - Yu , et al.	2020-08-04
Method and system for thinning wafer thereof Grant 10,727,074 - Hwang , et al.	2020-07-28
Method And Apparatus For Bonding Semiconductor Substrate App 20200227379 - Huang; Ying-Jui ; et al.	2020-07-16
Integrated Circuit Package and Method App 20200211922 - Chun; Shu-Rong ; et al.	2020-07-02
Fan-out interconnect structure and method for forming same Grant 10,700,025 - Yu , et al.	2020-06-30
Semicondcutor Package And Method Of Dicing Semiconductor Device App 20200203270 - Liu; Chung-Shi ; et al.	2020-06-25
Interconnect structure for semiconductor package and method of fabricating the interconnect structure Grant 10,679,866 - Hwang , et al.	2020-06-09
Package structure and manufacturing method thereof Grant 10,665,537 - Hwang , et al.	2020-05-26
Wafer Level Transfer Molding and Apparatus for Performing the Same App 20200114556 - Jang; Bor-Ping ; et al.	2020-04-16
Methods for Controlling Warpage in Packaging App 20200118969 - Hwang; Chien Ling ; et al.	2020-04-16
Mechanisms for Forming Bonding Structures App 20200105710 - Lin; Yeong-Jyh ; et al.	2020-04-02
Semiconductor Device And Manufacturing Method Thereof App 20200105689 - Hwang; Chien-Ling ; et al.	2020-04-02
Via Structure for Packaging and a Method of Forming App 20200058613 - Ho; Ming-Che ; et al.	2020-02-20
Electronic Device And Manufacturing Method Thereof App 20200044306 - Lee; Pei-Hsuan ; et al.	2020-02-06
Wafer level transfer molding and apparatus for performing the same Grant 10,513,070 - Jang , et al. Dec	2019-12-24
Methods for controlling warpage in packaging Grant 10,510,712 - Hwang , et al. Dec	2019-12-17
Mechanisms for forming bonding structures Grant 10,504,870 - Lin , et al. Dec	2019-12-10
Method of manufacturing a semiconductor device including through silicon plugs Grant 10,497,619 - Yu , et al. De	2019-12-03
Method Of Manufacturing Integrated Fan-out Package App 20190355694 - Wan; Albert ; et al.	2019-11-21
Via structure for packaging and a method of forming Grant 10,461,051 - Ho , et al. Oc	2019-10-29
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same App 20190326251 - Yu; Chen-Hua ; et al.	2019-10-24
Method and system for mounting components in semiconductor fabrication process Grant 10,438,922 - Hwang , et al. O	2019-10-08
Package Structure And Manufacturing Method Thereof App 20190304901 - Hwang; Chien-Ling ; et al.	2019-10-03
Semiconductor Device Having A Boundary Structure, A Package On Package Structure, And A Method Of Making App 20190237422 - Hwang; Chien Ling ; et al.	2019-08-01
Method of manufacturing integrated fan-out package Grant 10,366,966 - Wan , et al. July 30, 2	2019-07-30
Integrated fan-out package Grant 10,276,509 - Chang , et al.	2019-04-30
Semiconductor device having a boundary structure, a package on package structure, and a method of making Grant 10,276,531 - Hwang , et al.	2019-04-30
Methods for Controlling Warpage in Packaging App 20190123018 - Hwang; Chien Ling ; et al.	2019-04-25
Package structure, fan-out package structure and method of the same Grant 10,269,582 - Hwang , et al.	2019-04-23
Aligning Bumps In Fan-out Packaging Process App 20190103375 - Huang; Ying-Jui ; et al.	2019-04-04
Via Structure for Packaging and a Method of Forming App 20190088609 - Ho; Ming-Che ; et al.	2019-03-21
Conductive Micro Pin App 20190074259 - HUANG; Ying-Jui ; et al.	2019-03-07
Package Structure And Method Of Fabricating Package Structure App 20190067220 - Wan; Albert ; et al.	2019-02-28
Cu pillar bump with L-shaped non-metal sidewall protection structure Grant 10,163,837 - Hwang , et al. Dec	2018-12-25
Methods for controlling warpage in packaging Grant 10,157,881 - Hwang , et al. Dec	2018-12-18
Semiconductor Wafer Device And Manufacturing Method Thereof App 20180358255 - JANG; BOR-PING ; et al.	2018-12-13
Method Of Manufacturing A Semiconductor Device Including Through Silicon Plugs App 20180350678 - YU; Chen-Hua ; et al.	2018-12-06
Methods for stud bump formation Grant 10,147,693 - Hwang , et al. De	2018-12-04
Via structure for packaging and a method of forming Grant 10,134,700 - Ho , et al. November 20, 2	2018-11-20
Dam for Three-Dimensional Integrated Circuit App 20180323118 - Wang; Tsung-Ding ; et al.	2018-11-08
Method of manufacturing micro pins and isolated conductive micro pin Grant 10,115,690 - Huang , et al. October 30, 2	2018-10-30
Semiconductor wafer device and manufacturing method thereof Grant 10,056,285 - Jang , et al. August 21, 2	2018-08-21
Method of manufacturing a semiconductor device including through silicon plugs Grant 10,049,931 - Yu , et al. August 14, 2	2018-08-14
Packaging through Pre-Formed Metal Pins App 20180204816 - Yu; Chen-Hua ; et al.	2018-07-19
Wafer-level molding chase design Grant 10,020,211 - Yu , et al. July 10, 2	2018-07-10
Dam for three-dimensional integrated circuit Grant 10,020,236 - Wang , et al. July 10, 2	2018-07-10
Wafer-Level Underfill and Over-Molding App 20180175013 - Jang; Bor-Ping ; et al.	2018-06-21
Integrated fan-out package and method of fabricating the same Grant 9,984,960 - Hwang , et al. May 29, 2	2018-05-29
Package Structure, Fan-out Package Structure And Method Of The Same App 20180130673 - HWANG; CHIEN LING ; et al.	2018-05-10
Pick-and-place tool for packaging process Grant 9,966,357 - Hwang , et al. May 8, 2	2018-05-08
Integrated Fan-out Package App 20180090445 - Chang; Chih-Hao ; et al.	2018-03-29
Packaging through pre-formed metal pins Grant 9,929,118 - Yu , et al. March 27, 2	2018-03-27
Semiconductor Wafer Device And Manufacturing Method Thereof App 20180047611 - JANG; BOR-PING ; et al.	2018-02-15
Wafer Level Transfer Molding and Apparatus for Performing the Same App 20180043593 - Jang; Bor-Ping ; et al.	2018-02-15
Wafer-level underfill and over-molding Grant 9,893,044 - Jang , et al. February 13, 2	2018-02-13
Integrated Fan-out Package And Method Of Fabricating The Same App 20180025966 - Hwang; Chien-Ling ; et al.	2018-01-25
Integrated fan-out package and method of fabricating the same Grant 9,870,997 - Chang , et al. January 16, 2	2018-01-16
Package structure, fan-out package structure and method of the same Grant 9,870,929 - Hwang , et al. January 16, 2	2018-01-16
Mechanisms For Forming Bonding Structures App 20180005976 - Lin; Yeong-Jyh ; et al.	2018-01-04
Method of forming 3D integrated circuit package with panel type lid Grant 9,859,266 - Wang , et al. January 2, 2	2018-01-02
Method And System For Mounting Components In Semiconductor Fabrication Process App 20170352641 - HWANG; Chien-Ling ; et al.	2017-12-07
Integrated Fan-out Package And Method Of Fabricating The Same App 20170345764 - Chang; Chih-Hao ; et al.	2017-11-30
Semiconductor wafer device and manufacturing method thereof Grant 9,812,346 - Jang , et al. November 7, 2	2017-11-07
Wafer level transfer molding and apparatus for performing the same Grant 9,802,349 - Jang , et al. October 31, 2	2017-10-31
Mechanisms for forming bonding structures Grant 9,768,142 - Lin , et al. September 19, 2	2017-09-19
Semiconductor Device Having A Boundary Structure, A Package On Package Structure, And A Method Of Making App 20170256513 - Hwang; Chien Ling ; et al.	2017-09-07
Apparatus for separating wafer from carrier Grant 9,735,039 - Hwang , et al. August 15, 2	2017-08-15
Via Structure For Packaging And A Method Of Forming App 20170194276 - Ho; Ming-Che ; et al.	2017-07-06
Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap Grant 9,685,372 - Hwang , et al. June 20, 2	2017-06-20
Semiconductor device having a boundary structure, a package on package structure, and a method of making Grant 9,659,891 - Hwang , et al. May 23, 2	2017-05-23
Package Structure, Fan-out Package Structure And Method Of The Same App 20170110403 - HWANG; CHIEN LING ; et al.	2017-04-20
Cu Pillar Bump With L-shaped Non-metal Sidewall Protection Structure App 20170084563 - HWANG; Chien Ling ; et al.	2017-03-23
Via structure for packaging and a method of forming Grant 9,601,355 - Ho , et al. March 21, 2	2017-03-21
Method Of Forming 3D Integrated Circuit Package With Panel Type Lid App 20170077078 - Wang; Tsung-Ding ; et al.	2017-03-16
Methods for Controlling Warpage in Packaging App 20170032980 - Hwang; Chien Ling ; et al.	2017-02-02
Cu pillar bump with L-shaped non-metal sidewall protection structure Grant 9,524,945 - Hwang , et al. December 20, 2	2016-12-20
Packaging through Pre-Formed Metal Pins App 20160343681 - Yu; Chen-Hua ; et al.	2016-11-24
3D integrated circuit package processing with panel type lid Grant 9,502,383 - Wang , et al. November 22, 2	2016-11-22
Methods for forming apparatus for stud bump formation Grant 9,498,851 - Lin , et al. November 22, 2	2016-11-22
Methods for controlling warpage in packaging Grant 9,484,226 - Hwang , et al. November 1, 2	2016-11-01
Package-on-package structures and methods of manufacture thereof Grant 9,460,939 - Lee , et al. October 4, 2	2016-10-04
Fan-Out Interconnect Structure and Method for Forming Same App 20160284654 - Yu; Chen-Hua ; et al.	2016-09-29
Pillar bumps and process for making same Grant 9,449,931 - Lin , et al. September 20, 2	2016-09-20
Method Of Manufacturing Micro Pins And Isolated Conductive Micro Pin App 20160254239 - HUANG; Ying-Jui ; et al.	2016-09-01
Chip packages and methods of manufacture thereof Grant 9,425,179 - Hwang , et al. August 23, 2	2016-08-23
Interconnect Structure For Semiconductor Package And Method Of Fabricating The Interconnect Structure App 20160240451 - HWANG; Chien-Ling ; et al.	2016-08-18
Packaging through pre-formed metal pins Grant 9,418,953 - Yu , et al. August 16, 2	2016-08-16
Method Of Manufacturing A Semiconductor Device Including Through Silicon Plugs App 20160197014 - YU; Chen-Hua ; et al.	2016-07-07
Fan-out interconnect structure and method for forming same Grant 9,368,460 - Yu , et al. June 14, 2	2016-06-14
Via Structure For Packaging And A Method Of Forming App 20160155650 - Ho; Ming-Che ; et al.	2016-06-02
Package-on-package Structures And Methods Of Manufacture Thereof App 20160148820 - Lee; Pei-Hsuan ; et al.	2016-05-26
Semiconductor device with copper-tin compound on copper connector Grant 9,324,670 - Hwang , et al. April 26, 2	2016-04-26
Semiconductor Wafer Device And Manufacturing Method Thereof App 20160099165 - JANG; BOR-PING ; et al.	2016-04-07
Method of manufacturing a semiconductor device including through silicon plugs Grant 9,287,440 - Yu , et al. March 15, 2	2016-03-15
Method of making a conductive pillar bump with non-metal sidewall protection structure Grant 9,287,171 - Wu , et al. March 15, 2	2016-03-15
Chip Packages And Methods Of Manufacture Thereof App 20160064367 - Hwang; Chien Ling ; et al.	2016-03-03
Copper pillar bump with cobalt-containing sidewall protection layer Grant 9,275,965 - Hwang , et al. March 1, 2	2016-03-01
Via structure for packaging and a method of forming Grant 9,263,302 - Ho , et al. February 16, 2	2016-02-16
Semiconductor wafer device Grant 9,236,351 - Jang , et al. January 12, 2	2016-01-12
Method And System For Thinning Wafer Thereof App 20150371860 - HWANG; Chien Ling ; et al.	2015-12-24
Wafer-level Molding Chase Design App 20150364456 - Yu; Chen-Hua ; et al.	2015-12-17
Pick-and-Place Tool for Packaging Process App 20150333033 - Hwang; Chien Ling ; et al.	2015-11-19
Method Of Making A Pillar Structure Having A Non-metal Sidewall Protection Structure And Integrated Circuit Including The Same App 20150325546 - HWANG; Chien Ling ; et al.	2015-11-12
Dam for Three-Dimensional Integrated Circuit App 20150262900 - Wang; Tsung-Ding ; et al.	2015-09-17
Methods for Controlling Warpage in Packaging App 20150262845 - Hwang; Chien Ling ; et al.	2015-09-17
3d Integrated Circuit Package Processing With Panel Type Lid App 20150262973 - Wang; Tsung-Ding ; et al.	2015-09-17
Method of making a pillar structure having a non-metal sidewall protection structure Grant 9,136,167 - Hwang , et al. September 15, 2	2015-09-15
Method and system for thinning wafer thereof Grant 9,129,899 - Hwang , et al. September 8, 2	2015-09-08
Via Structure For Packaging And A Method Of Forming App 20150243531 - Ho; Ming-Che ; et al.	2015-08-27
Methods for Stud Bump Formation and Apparatus for Performing the Same App 20150235975 - Hwang; Chien Ling ; et al.	2015-08-20
Method Of Forming Cu Pillar Bump With Non-metal Sidewall Spacer And Metal Top Cap App 20150228533 - HWANG; Chien Ling ; et al.	2015-08-13
Pick-and-place tool for packaging process Grant 9,105,760 - Hwang , et al. August 11, 2	2015-08-11
Methods for controlling warpage in packaging Grant 9,093,337 - Hwang , et al. July 28, 2	2015-07-28
Method and system for manufacturing semiconductor device Grant 9,085,049 - Hwang , et al. July 21, 2	2015-07-21
Packaging through Pre-Formed Metal Pins App 20150200171 - Yu; Chen-Hua ; et al.	2015-07-16
Copper pillar bump with cobalt-containing sidewall protection Grant 9,048,135 - Hwang , et al. June 2, 2	2015-06-02
Novel Semiconductor Package With Through Silicon Vias App 20150147834 - Yu; Chen-Hua ; et al.	2015-05-28
Wafer-Level Underfill and Over-Molding App 20150130111 - Jang; Bor-Ping ; et al.	2015-05-14
Apparatus for stud bump formation Grant 9,021,682 - Hwang , et al. May 5, 2	2015-05-05
Cu pillar bump with non-metal sidewall spacer and metal top cap Grant 9,018,758 - Hwang , et al. April 28, 2	2015-04-28
Methods for Forming Apparatus for Stud Bump Formation App 20150102091 - Lin; Yeong-Jyh ; et al.	2015-04-16
Semiconductor Device And Manufacturing Method Thereof App 20150097272 - JANG; BOR-PING ; et al.	2015-04-09
Methods for Controlling Warpage in Packaging App 20150093858 - Hwang; Chien Ling ; et al.	2015-04-02
Semiconductor Device Having A Boundary Structure, A Package On Package Structure, And A Method Of Making App 20150069604 - HWANG; Chien Ling ; et al.	2015-03-12
Wafer-level underfill and over-molding Grant 8,951,037 - Jang , et al. February 10, 2	2015-02-10
Semiconductor package with through silicon vias Grant 8,946,742 - Yu , et al. February 3, 2	2015-02-03
Method and device for cutting semiconductor wafers Grant 8,940,618 - Hwang , et al. January 27, 2	2015-01-27
Mechanisms For Forming Bonding Structures App 20150021760 - LIN; Yeong-Jyh ; et al.	2015-01-22
Method And System For Thinning Wafer Thereof App 20150024606 - HWANG; Chien-Ling ; et al.	2015-01-22
Methods for forming apparatus for stud bump formation Grant 8,936,730 - Lin , et al. January 20, 2	2015-01-20
Apparatus For Separating Wafer From Carrier App 20140360671 - HWANG; Chien Ling ; et al.	2014-12-11
Method Of Making A Pillar Structure Having A Non-metal Sidewall Protection Structure App 20140363970 - HWANG; Chien Ling ; et al.	2014-12-11
Pillar Bumps and Process for Making Same App 20140363966 - Lin; Cheng-Chung ; et al.	2014-12-11
Copper Pillar Bump With Cobalt-containing Sidewall Protection Layer App 20140342546 - HWANG; Chien Ling ; et al.	2014-11-20
Method Of Making A Conductive Pillar Bump With Non-metal Sidewall Protection Structure App 20140335687 - WU; Yi-Wen ; et al.	2014-11-13
Wafer Level Transfer Molding And Apparatus For Performing The Same App 20140291881 - Jang; Bor-Ping ; et al.	2014-10-02
Cu pillar bump with non-metal sidewall protection structure Grant 8,841,766 - Hwang , et al. September 23, 2	2014-09-23
Fan-Out Interconnect Structure and Method for Forming Same App 20140264930 - Yu; Chen-Hua ; et al.	2014-09-18
Apparatus and method of separating wafer from carrier Grant 8,834,662 - Hwang , et al. September 16, 2	2014-09-16
Wafer's ambiance control Grant 8,827,695 - Hsiao , et al. September 9, 2	2014-09-09
Pillar bumps and process for making same Grant 8,823,166 - Lin , et al. September 2, 2	2014-09-02
Copper pillar bump with non-metal sidewall protection structure and method of making the same Grant 8,823,167 - Wu , et al. September 2, 2	2014-09-02
Method And System For Manufacturing Semiconductor Device App 20140154871 - Hwang; Chien-Ling ; et al.	2014-06-05
Semiconductor Device with Copper-Tin Compound on Copper Connector App 20140131863 - Hwang; Chien Ling ; et al.	2014-05-15
Package assembly cleaning process using vaporized solvent Grant 8,702,871 - Hsiao , et al. April 22, 2	2014-04-22
Apparatus for Holding Semiconductor Wafers App 20140097175 - Yu; Chen-Hua ; et al.	2014-04-10
Method for reducing voids in a copper-tin interface and structure formed thereby Grant 8,679,591 - Hwang , et al. March 25, 2	2014-03-25
In-situ accuracy control in flux dipping Grant 8,668,131 - Hsiao , et al. March 11, 2	2014-03-11
Methods for Forming Apparatus for Stud Bump Formation App 20140061153 - Lin; Yeong-Jyh ; et al.	2014-03-06
Innovative Multi-Purpose Dipping Plate App 20140048586 - Jang; Bor-Ping ; et al.	2014-02-20
Apparatus for holding semiconductor wafers Grant 8,652,260 - Yu , et al. February 18, 2	2014-02-18
Pick-and-Place Tool for Packaging Process App 20140030849 - Hwang; Chien Ling ; et al.	2014-01-30
Conductive feature for semiconductor substrate and method of manufacture Grant 8,587,119 - Hwang , et al. November 19, 2	2013-11-19
Method Of Manufacturing A Semiconductor Device Including Through Silicon Plugs App 20130302979 - YU; Chen-Hua ; et al.	2013-11-14
Protection layer for preventing UBM layer from chemical attack and oxidation Grant 8,569,897 - Liu , et al. October 29, 2	2013-10-29
Post passivation interconnect with oxidation prevention layer Grant 8,569,887 - Hwang , et al. October 29, 2	2013-10-29
Apparatus and Method for the Singulation of a Semiconductor Wafer App 20130273717 - Hwang; Chien Ling ; et al.	2013-10-17
Pick-and-place tool for packaging process Grant 8,546,802 - Hwang , et al. October 1, 2	2013-10-01
Apparatus And Method Of Separating Wafer From Carrier App 20130248119 - HWANG; Chien Ling ; et al.	2013-09-26
Methods for stud bump formation and apparatus for performing the same Grant 8,540,136 - Lin , et al. September 24, 2	2013-09-24
Method And Device For Cutting Semiconductor Wafers App 20130244403 - HWANG; Chien Ling ; et al.	2013-09-19
Wafer-Level Underfill and Over-Molding App 20130228951 - Jang; Bor-Ping ; et al.	2013-09-05
Heat dissipation by through silicon plugs Grant 8,507,940 - Yu , et al. August 13, 2	2013-08-13
Methods for Stud Bump Formation and Apparatus for Performing the Same App 20130167373 - Hwang; Chien Ling ; et al.	2013-07-04
Integrated Reflow and Cleaning Process and Apparatus for Performing the Same App 20130146647 - Liu; Chung-Shi ; et al.	2013-06-13
Cu pillar bump with non-metal sidewall protection structure Grant 8,441,124 - Wu , et al. May 14, 2	2013-05-14
Pick-and-Place Tool for Packaging Process App 20130115752 - Hwang; Chien Ling ; et al.	2013-05-09
Package Assembly Cleaning Process Using Vaporized Solvent App 20130048027 - Hsiao; Yi-Li ; et al.	2013-02-28
Jigs with controlled spacing for bonding dies onto package substrates Grant 8,373,269 - Hsiao , et al. February 12, 2	2013-02-12
Thermal compressive bonding with separate die-attach and reflow processes Grant 8,317,077 - Hwang , et al. November 27, 2	2012-11-27
Doping Minor Elements into Metal Bumps App 20120286423 - Cheng; Ming-Da ; et al.	2012-11-15
Copper Pillar Bump With Non-metal Sidewall Protection Structure And Method Of Making The Same App 20120280388 - WU; Yi-Wen ; et al.	2012-11-08
Substrate Assembly Carrier Using Electrostatic Force App 20120227886 - Hsiao; Yi-Li ; et al.	2012-09-13
Method of forming semiconductor die Grant 8,258,055 - Hwang , et al. September 4, 2	2012-09-04
In-Situ Accuracy Control in Flux Dipping App 20120211547 - Hsiao; Yi-Li ; et al.	2012-08-23
Doping minor elements into metal bumps Grant 8,227,334 - Cheng , et al. July 24, 2	2012-07-24
Thermal compressive bond head Grant 8,177,862 - Hwang , et al. May 15, 2	2012-05-15
Thermal Compressive Bonding with Separate Die-Attach and Reflow Processes App 20120111922 - Hwang; Chien Ling ; et al.	2012-05-10
Semiconductor Device Having Under-bump Metallization (ubm) Structure And Method Of Forming The Same App 20120098124 - WU; Yi-Wen ; et al.	2012-04-26
Copper Pillar Bump With Cobalt-containing Sidewall Protection App 20120091577 - HWANG; Chien Ling ; et al.	2012-04-19
Thermal Compressive Bond Head App 20120088362 - Hwang; Chien Ling ; et al.	2012-04-12
Thermally Efficient Packaging For A Photonic Device App 20120068218 - Chang; Hung-Pin ; et al.	2012-03-22
Polishing apparatus Grant 8,133,097 - Lin , et al. March 13, 2	2012-03-13
Pillar Bumps and Process for Making Same App 20120049346 - Lin; Cheng-Chung ; et al.	2012-03-01
Thermal compressive bonding with separate die-attach and reflow processes Grant 8,104,666 - Hwang , et al. January 31, 2	2012-01-31
Doping Minor Elements into Metal Bumps App 20120018878 - Cheng; Ming-Da ; et al.	2012-01-26
Conductive Bump For Semiconductor Substrate And Method Of Manufacture App 20120007230 - Hwang; Chien Ling ; et al.	2012-01-12
Cu Pillar Bump With Non-metal Sidewall Spacer And Metal Top Cap App 20110298123 - HWANG; Chien Ling ; et al.	2011-12-08
Cu Pillar Bump With L-shaped Non-metal Sidewall Protection Structure App 20110285011 - HWANG; Chien Ling ; et al.	2011-11-24
Cu Pillar Bump With Non-metal Sidewall Protection Structure App 20110266667 - WU; Yi-Wen ; et al.	2011-11-03
Conductive Feature For Semiconductor Substrate And Method Of Manufacture App 20110254159 - HWANG; Chien Ling ; et al.	2011-10-20
Heat Dissipation By Through Silicon Plugs App 20110241061 - YU; Chen-Hua ; et al.	2011-10-06
Novel Semiconductor Package With Through Silicon Vias App 20110241040 - YU; Chen-Hua ; et al.	2011-10-06
Cu Pillar Bump With Non-metal Sidewall Protection Structure App 20110233761 - Hwang; Chien Ling ; et al.	2011-09-29
Electroless plating apparatus with non-liquid heating source Grant 7,966,968 - Chan , et al. June 28, 2	2011-06-28
Method for Reducing Voids in a Copper-Tin Interface and Structure Formed Thereby App 20110115077 - Hwang; Chien Ling ; et al.	2011-05-19
Pillar Bump With Barrier Layer App 20110101523 - HWANG; Chien Ling ; et al.	2011-05-05
Post Passivation Interconnect With Oxidation Prevention Layer App 20110101521 - HWANG; Chien Ling ; et al.	2011-05-05
Protection Layer For Preventing Ubm Layer From Chemical Attack And Oxidation App 20110062580 - LIU; Chung-Shi ; et al.	2011-03-17
Rapid cooling system for RTP chamber Grant 7,905,109 - Hwang , et al. March 15, 2	2011-03-15
Polishing Apparatus App 20100285723 - Lin; Yu-Liang ; et al.	2010-11-11
Apparatus for Holding Semiconductor Wafers App 20100032096 - Yu; Chen-Hua ; et al.	2010-02-11
Plural Gas Distribution System App 20100018463 - Yu; Chen-Hua ; et al.	2010-01-28
Novel Wafer's Ambiance Control App 20090317214 - Hsiao; Yi-Li ; et al.	2009-12-24
Electroless plating apparatus with non-liquid heating source App 20080268553 - Chan; Cheng Hsun ; et al.	2008-10-30
Rapid cooling system for RTP chamber App 20070056512 - Hwang; Chien Ling ; et al.	2007-03-15
Slurry residence time enhancement system App 20070032180 - Hwang; Chien Ling ; et al.	2007-02-08