Hwang; Chi Won

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hwang; Chi Won.The latest application filed is for "printed circuit board".

Company Profile

0.16.17

Hwang; Chi Won - Suwon-si KR
Hwang; Chi-won - Tsukuba JP
Hwang; Chi Won - Daejeon KR
Hwang; Chi-won - Ibaraki N/A JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed circuit board and method of manufacturing the same Grant 11,178,761 - Cho , et al. November 16, 2	2021-11-16
Printed circuit board Grant 10,925,161 - Ko , et al. February 16, 2	2021-02-16
Printed Circuit Board App 20200196446 - KO; Kyung-Hwan ; et al.	2020-06-18
Conductive ball mounting device Grant 9,832,884 - Hwang November 28, 2	2017-11-28
Methods Of Forming High Density Metal Wiring For Fine Line And Space Packaging Applications And Structures Formed Thereby App 20170004978 - Hwang; Chi-won ; et al.	2017-01-05
Conductive Ball Mounting Device App 20150264818 - HWANG; Chi Won	2015-09-17
Electrolytic cell for flow through-continuous deionization Grant 9,096,941 - Hwang , et al. August 4, 2	2015-08-04
Method for manufacturing adsorptive ball for recovering precious metals and flow through-continuous deionization (FT-CDI) apparatus using the same Grant 8,975,207 - Hwang , et al. March 10, 2	2015-03-10
Electrolytic Cell for Flow Through-Continuous Deionization App 20130277210 - Hwang; Teak Sung ; et al.	2013-10-24
Methods for making multi-chip packaging using an interposer Grant 8,387,240 - Muthukumar , et al. March 5, 2	2013-03-05
Carbon nanotube-reinforced solder caps, and chip packages and systems containing same Grant 8,391,016 - Hwang March 5, 2	2013-03-05
Methods of forming C4 round dimple metal stud bumps for fine pitch packaging applications and structures formed thereby Grant 7,952,203 - Hwang May 31, 2	2011-05-31
Multi-chip Packaging Using An Interposer Such As A Silicon Based Interposer With Through-silicon-vias App 20110067236 - MUTHUKUMAR; Sriram ; et al.	2011-03-24
Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias Grant 7,882,628 - Muthukumar , et al. February 8, 2	2011-02-08
Multi-chip packaging using an interposer with through-vias Grant 7,841,080 - Muthukumar , et al. November 30, 2	2010-11-30
Carbon nanotube-reinforced solder caps, methods of assembling same, and chip packages and systems containing same App 20100084764 - Hwang; Chi-Won	2010-04-08
Methods of forming C4 metal stud bump for fine pitch packaging applications and structures formed thereby App 20100052159 - Hwang; Chi-won	2010-03-04
Method of assembling carbon nanotube reinforced solder caps Grant 7,600,667 - Hwang October 13, 2	2009-10-13
Sintered metallic thermal interface materials for microelectronic cooling assemblies Grant 7,535,099 - Suh , et al. May 19, 2	2009-05-19
Horizontal Carbon Nanotubes by Vertical Growth and Rolling Grant 7,514,116 - Natekar , et al. April 7, 2	2009-04-07
Nano-scale Particle Paste For Wiring Microelectronic Devices Using Ink-jet Printing App 20090072013 - NATEKAR; DEVENDRA ; et al.	2009-03-19
In-situ Chip Attachment Using Self-organizing Solder App 20090057378 - Hwang; Chi-Won ; et al.	2009-03-05
Multi-chip Packaging Using An Interposer Such As A Silicon Based Interposer With Through-silicon-vias App 20080295329 - Muthukumar; Sriram ; et al.	2008-12-04
Multi-chip Packaging Using An Interposer Such As A Silicon Based Interposer With Through-silicon-vias App 20080295325 - Muthukumar; Sriram ; et al.	2008-12-04
Carbon Nanotube-reinforced Solder Caps, Methods Of Assembling Same, And Chip Packages And Systems Containing Same App 20080078813 - Hwang; Chi-won	2008-04-03
Sintered metallic thermal interface materials for microelectronic cooling assemblies App 20080073776 - Suh; Daewoong ; et al.	2008-03-27
Solder composition having dispersoid particles for increased creep resistance App 20070227627 - Suh; Daewoong ; et al.	2007-10-04
Carbon nanotube reinforced metallic layer Grant 7,268,077 - Hwang September 11, 2	2007-09-11
Nano-scale particle paste for wiring microelectronic devices using deposition and ink-jet printing App 20070152194 - Natekar; Devendra ; et al.	2007-07-05
Carbon nanotube reinforced metallic layer App 20070128883 - Hwang; Chi-Won	2007-06-07

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