loadpatents
name:-0.0096678733825684
name:-0.013946056365967
name:-0.0004730224609375
Huynh; Long Patent Filings

Huynh; Long

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huynh; Long.The latest application filed is for "detection of welded contactor using ac coupling".

Company Profile
0.15.9
  • Huynh; Long - Gardena CA
  • Huynh; Long - Santa Clara CA
  • Huynh; Long - San Diego CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Systems and methods for connecting battery strings to a DC bus
Grant 10,449,867 - Hong , et al. Oc
2019-10-22
Pre-charge system and method
Grant 10,076,964 - Hong , et al. September 18, 2
2018-09-18
Wafer-level packaging using wire bond wires in place of a redistribution layer
Grant 10,008,469 - Katkar , et al. June 26, 2
2018-06-26
Fan-out wafer-level packaging using metal foil lamination
Grant 9,847,238 - Li , et al. December 19, 2
2017-12-19
Detection of welded contactor using ac coupling
Grant 9,817,050 - Weicker , et al. November 14, 2
2017-11-14
Systems and methods for disengaging a battery
Grant 9,783,078 - Huynh , et al. October 10, 2
2017-10-10
Detection Of Welded Contactor Using Ac Coupling
App 20170205455 - Weicker; Phillip J. ;   et al.
2017-07-20
Pre-charge System And Method
App 20170166065 - Hong; Michael ;   et al.
2017-06-15
Fan-Out Wafer-Level Packaging Using Metal Foil Lamination
App 20170170031 - Li; Xuan ;   et al.
2017-06-15
Systems And Methods For Connecting Battery Strings To A Dc Bus
App 20170166075 - Hong; Michael ;   et al.
2017-06-15
Fan-out wafer-level packaging using metal foil lamination
Grant 9,646,946 - Li , et al. May 9, 2
2017-05-09
Systems And Methods For Disengaging A Battery
App 20170120770 - Huynh; Long ;   et al.
2017-05-04
Fan-out Wafer-level Packaging Using Metal Foil Lamination
App 20170103957 - Li; Xuan ;   et al.
2017-04-13
Wafer-level Packaging Using Wire Bond Wires In Place Of A Redistribution Layer
App 20170069591 - Katkar; Rajesh ;   et al.
2017-03-09
Wafer level packages with mechanically decoupled fan-in and fan-out areas
Grant 9,543,277 - Lee , et al. January 10, 2
2017-01-10
Systems and methods for disengaging a battery
Grant 9,525,291 - Huynh , et al. December 20, 2
2016-12-20
Wafer-level packaging using wire bond wires in place of a redistribution layer
Grant 9,502,372 - Katkar , et al. November 22, 2
2016-11-22
Wafer-level Packaging Using Wire Bond Wires In Place Of A Redistribution Layer
App 20160322326 - KATKAR; Rajesh ;   et al.
2016-11-03
Filter loop structure for synchronization in a mobile communication terminal and a method of using the same
Grant 7,016,444 - Parr , et al. March 21, 2
2006-03-21
Fading communications channel estimation and compensation
Grant 6,680,987 - Beidas , et al. January 20, 2
2004-01-20
Filter loop structure for synchronization in a mobile communication terminal and a method of using the same
App 20020150190 - Parr, Michael ;   et al.
2002-10-17
Receiver selection based on delay spread estimation
Grant 6,028,901 - Huynh , et al. February 22, 2
2000-02-22
Time division multiple access cellular communication system and method employing base station diversity transmission
Grant 5,574,989 - Watson , et al. November 12, 1
1996-11-12
Doppler bandwidth dependent estimation of a communications channel
Grant 5,513,221 - Parr , et al. April 30, 1
1996-04-30

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed