| Patent | Date |
|---|
Apparatus for transferring plurality of micro devices and methods of fabrication
Grant 11,387,029 - Hussein , et al. July 12, 2 | 2022-07-12 |
Apparatus For Transferring Plurality Of Micro Devices And Methods Of Fabrication
App 20210241955 - Hussein; Makarem A. ; et al. | 2021-08-05 |
Electromagnetic tool for transferring micro devices and methods of transfer
Grant 11,056,363 - Hussein , et al. July 6, 2 | 2021-07-06 |
Electromagnetic tool for transferring micro devices and methods of fabrication
Grant 10,984,937 - Hussein , et al. April 20, 2 | 2021-04-20 |
Electromagnetic Tool For Transferring Micro Devices And Methods Of Fabrication
App 20200082965 - Hussein; Makarem A. ; et al. | 2020-03-12 |
Electromagnetic Tool For Transferring Micro Devices And Methods Of Transfer
App 20200083069 - Hussein; Makarem A. ; et al. | 2020-03-12 |
Antireflective coatings for via fill and photolithography applications and methods of preparation thereof
Grant 8,992,806 - Li , et al. March 31, 2 | 2015-03-31 |
Dielectric spacers for metal interconnects and method to form the same
Grant 8,394,701 - Hussein , et al. March 12, 2 | 2013-03-12 |
Antireflective Coatings for Via Fill and Photolithography Applications and Methods of Preparation Thereof
App 20120001135 - Li; Bo ; et al. | 2012-01-05 |
Antireflective coatings for via fill and photolithography applications and methods of preparation thereof
Grant 8,053,159 - Li , et al. November 8, 2 | 2011-11-08 |
Dielectric Spacers For Metal Interconnects And Method To Form The Same
App 20110171823 - Hussein; Makarem A. ; et al. | 2011-07-14 |
Dielectric spacers for metal interconnects and method to form the same
Grant 7,923,760 - Hussein , et al. April 12, 2 | 2011-04-12 |
Dielectric Spacers For Metal Interconnects And Method To Form The Same
App 20100071941 - Hussein; Makarem A. ; et al. | 2010-03-25 |
Soluble hard mask for interlayer dielectric patterning
Grant 7,659,196 - Abdelrahman , et al. February 9, 2 | 2010-02-09 |
Dielectric spacers for metal interconnects and method to form the same
Grant 7,649,239 - Hussein , et al. January 19, 2 | 2010-01-19 |
Airgap Interconnect System
App 20090001594 - Yoo; Hui Jae ; et al. | 2009-01-01 |
Cleaning composition and method of cleaning semiconductor substrate
Grant 7,442,675 - Yokoi , et al. October 28, 2 | 2008-10-28 |
Soluble hard mask for interlayer dielectric patterning
App 20080153283 - Abdelrahman; Magdy S. ; et al. | 2008-06-26 |
Methods and apparatuses for producing a polymer memory device
Grant 7,326,981 - Hussein , et al. February 5, 2 | 2008-02-05 |
Dielectric spacers for metal interconnects and method to form the same
App 20070257368 - Hussein; Makarem A. ; et al. | 2007-11-08 |
Photoresist top coat out-of-band illumination filter for photolithography
App 20070231751 - Bristol; Robert L. ; et al. | 2007-10-04 |
Continuous metal interconnects
Grant 7,166,922 - Hussein January 23, 2 | 2007-01-23 |
Damascene process for fabricating interconnect layers in an integrated circuit
Grant 7,157,380 - Dubin , et al. January 2, 2 | 2007-01-02 |
Methods and apparatuses for producing a polymer memory device
App 20060157764 - Hussein; Makarem A. ; et al. | 2006-07-20 |
Methods and apparatuses for producing a polymer memory device
Grant 7,078,754 - Hussein , et al. July 18, 2 | 2006-07-18 |
Stress mitigation layer to reduce under bump stress concentration
Grant 7,071,554 - Hussein , et al. July 4, 2 | 2006-07-04 |
Thermoelectric cooling for microelectronic packages and dice
Grant 6,981,380 - Chrysler , et al. January 3, 2 | 2006-01-03 |
Stress mitigation layer to reduce under bump stress concentration
App 20050275095 - Hussein, Makarem A. ; et al. | 2005-12-15 |
Antireflective coatings for via fill and photolithography applications and methods of preparation thereof
App 20050171277 - Li, Bo ; et al. | 2005-08-04 |
Damascene process for fabricating interconnect layers in an integrated circuit
App 20050148190 - Dubin, Valery M. ; et al. | 2005-07-07 |
Method of forming an air gap intermetal layer dielectric (ILD) by utilizing a dielectric material to bridge underlying metal lines
Grant 6,908,829 - Hussein , et al. June 21, 2 | 2005-06-21 |
Methods and apparatuses for producing a polymer memory device
Grant 6,900,063 - Hussein , et al. May 31, 2 | 2005-05-31 |
Methods And Apparatuses For Producing A Polymer Memory Device
App 20050084985 - Hussein, Makarem A. ; et al. | 2005-04-21 |
Methods and apparatuses for producing a polymer memory device
App 20050082584 - Hussein, Makarem A. ; et al. | 2005-04-21 |
Cleaning composition, method of cleaning semiconductor substrate, and method of forming wiring on semiconductor substrate
App 20040259761 - Yokoi, Shigeru ; et al. | 2004-12-23 |
Method integrating polymeric interlayer dielectric in integrated circuits
Grant 6,774,037 - Hussein , et al. August 10, 2 | 2004-08-10 |
Thermoelectric cooling for microelectronic packages and dice
App 20040118129 - Chrysler, Gregory M. ; et al. | 2004-06-24 |
Transistor having a deposited dual-layer spacer structure
Grant 6,720,631 - Brigham , et al. April 13, 2 | 2004-04-13 |
Method integrating polymeric interlayer dielectric in integrated circuits
App 20030216057 - Hussein, Makarem A. ; et al. | 2003-11-20 |
Photoimageable material patterning techniques useful in fabricating conductive lines in circuit structures
Grant 6,649,515 - Moon , et al. November 18, 2 | 2003-11-18 |
Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs
App 20030207561 - Dubin, Valery M. ; et al. | 2003-11-06 |
Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures
App 20030207560 - Dubin, Valery M. ; et al. | 2003-11-06 |
Method of forming an air gap intermetal layer dielectric (ILD) by utilizing a dielectric material to bridge underlying metal lines
App 20030168747 - Hussein, Makarem A. ; et al. | 2003-09-11 |
Pattern-sensitive deposition for damascene processing
Grant 6,406,995 - Hussein , et al. June 18, 2 | 2002-06-18 |
Method for patterning dual damascene interconnects using a sacrificial light absorbing material
Grant 6,365,529 - Hussein , et al. April 2, 2 | 2002-04-02 |
Method For Patterning Dual Damascene Interconnects Using A Sacrificial Light Absorbing Material
App 20010055725 - HUSSEIN, MAKAREM A. ; et al. | 2001-12-27 |
Method for patterning dual damascene interconnects using a sacrificial light absorbing material
Grant 6,329,118 - Hussein , et al. December 11, 2 | 2001-12-11 |
Transistor Having A Deposited Dual-layer Spacer Structure
App 20010042894 - BRIGHAM, LAWRENCE N. ; et al. | 2001-11-22 |
Patterning Conductive Lines In Circuit Structures
App 20010021581 - MOON, PETER K ; et al. | 2001-09-13 |
Process to manufacture continuous metal interconnects
Grant 6,169,024 - Hussein January 2, 2 | 2001-01-02 |
Method of making a transistor having a deposited dual-layer spacer structure
Grant 5,714,413 - Brigham , et al. February 3, 1 | 1998-02-03 |
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