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Patent applications and USPTO patent grants for Hussain; Rafiqul.The latest application filed is for "semiconductor chip device with thermal interface material frame".
Patent | Date |
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Semiconductor Chip Device With Thermal Interface Material Frame App 20130105975 - Hussain; Rafiqul ;   et al. | 2013-05-02 |
Circuit Board Clamping Mechanism App 20120229999 - Hussain; Rafiqul | 2012-09-13 |
Force measurement on test and system level test environment under a printed circuit board App 20030234644 - Hussain, Rafiqul ;   et al. | 2003-12-25 |
Measuring force on dies and substrates App 20030234394 - Hussain, Rafiqul ;   et al. | 2003-12-25 |
Multi-layered pin grid array interposer apparatus and method for testing semiconductor devices having a non-pin grid array footprint Grant 6,344,684 - Hussain , et al. February 5, 2 | 2002-02-05 |
System level test socket Grant 6,341,963 - Hussain January 29, 2 | 2002-01-29 |
System level test socket App 20020004339 - Hussain, Rafiqul | 2002-01-10 |
Micro BGA stacking scheme Grant 5,598,033 - Behlen , et al. January 28, 1 | 1997-01-28 |
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