Huschka; Andreas

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huschka; Andreas.The latest application filed is for "multi-layer printed circuit board comprising a through connection for high frequency applications".

Company Profile

0.3.5

Huschka; Andreas - Dresden DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-layer printed circuit board comprising a through connection for high frequency applications Grant 7,394,027 - Kaluzni , et al. July 1, 2	2008-07-01
ESD protection circuit for radio frequency input/output terminals in an integrated circuit Grant 7,224,949 - Kluge , et al. May 29, 2	2007-05-29
Multi-layer printed circuit board comprising a through connection for high frequency applications App 20060131611 - Kaluzni; Heiko ; et al.	2006-06-22
Circuit and a method for controlling the bias current in a switched capacitor circuit Grant 6,891,439 - Jaehne , et al. May 10, 2	2005-05-10
Semiconductor die package having two die paddles App 20040159929 - Huschka, Andreas ; et al.	2004-08-19
Circuit and a method for controlling the bias current in a switched capacitor circuit App 20040085135 - Jaehne, Rolf ; et al.	2004-05-06
ESD protection circuit for radio frequency input/output terminals in an integrated circuit App 20030183403 - Kluge, Wolfram ; et al.	2003-10-02
Semiconductor die package having two die paddles App 20030151123 - Huschka, Andreas ; et al.	2003-08-14

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